DS2117M

9 of 9

DS2117M 36-PIN SSOP PACKAGE

CSP option - mechanical drawing

Please check the following web location for latest information on our Chip Scale Package (a.k.a

"solder bump") "http://www.dalsemi.com/DocControl/Chips/index.html"

DIM

MIN

MAX

A

2.44

2.64

A1

0.12

-

b

0.29

0.43

c

0.23

0.32

D

15.20

15.54

E

10.11

10.52

E1

7.40

7.60

e

0.80 BSC

h

0.25

0.71

L

0.51

1.02

DIMENSIONS D AND E1 INCLUDE MOLD MISMATCH, BUT DO NOT

INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD

FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.254

MM PER SIDE.

SECTION A-A DIMENSIONS APPLY TO THE FLAT SECTION OF THE

LEAD BETWEEN 0.13 TO 0.25 MM FROM THE LEAD TIP.

THE CHAMFER ON THE BODY IS OPTIONAL. IF IT IS NOT PRESENT,

A VISUAL INDEX FEATURE MUST BE LOCATED WITHIN THE

CROSS-HATCHED AREA.

DIMENSIONS ARE IN MILLIMETERS