APC308 datasheet(13/15 Pages) ETC

13 / 15 page

 ANPEC Electronics Corp.

Rev. A.1 - Oct., 2001

APC308

www.anpec.com.tw

Reference JEDEC Standard J-STD-020A APRIL 1999

Reflow Condition (IR/Convection or VPR Reflow)

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb

Lead Solderability

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Packaging

2500 devices per reel

Pre-heat temperature

183 C

Peak temperature

Time

Classification Reflow Profiles

Convection or IR/

Convection

VPR

Average ramp-up rate(183°C to Peak)

3°C/second max.

10 °C /second max.

Preheat temperature 125 ± 25°C)

120 seconds max

Temperature maintained above 183°C

60 150 seconds

Time within 5°C of actual peak temperature 10 20 seconds

60 seconds

Peak temperature range

220 +5/-0°C or 235 +5/-0°C 215-219°C or 235 +5/-0°C

Ramp-down rate

6 °C /second max.

10 °C /second max.

Time 25°C to peak temperature

6 minutes max.

Package Reflow Conditions

pkg. thickness ≥≥≥≥ 2.5mm

and all bgas

pkg. thickness < 2.5mm and

pkg. volume ≥≥≥≥ 350 mm³

pkg. thickness < 2.5mm and pkg.

volume < 350mm³

Convection 220 +5/-0 °C

Convection 235 +5/-0 °C

VPR 215-219 °C

VPR 235 +5/-0 °C

IR/Convection 220 +5/-0 °C

IR/Convection 235 +5/-0 °C

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