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LT5514 bảng dữ liệu(PDF) 19 Page - Linear Technology |
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LT5514 bảng dữ liệu(HTML) 19 Page - Linear Technology |
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19 / 20 page ![]() 19 LT5514 5514f APPLICATIO S I FOR ATIO Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. At high frequency, the difference between the top and bottom curves in Figure 12 is simply power loss. Starting from the LT5514 intrinsic performance at ROUT = 200Ω (top curve), the next lower curve takes into account the transformer insertion loss. The next curve below this shows the LT5514 OIP3 with ROUT = 100Ω. The bottom curve in the plot includes the effects of transformer insertion loss, with ROUT = 100Ω, and the additional effect of loss due to RMATCH. The transformer board can provide a differential output when Jumper J2 is removed. The Wideband Differential Output Application Board (Fig- ure 11) is an example of direct coupling (no transformer) to the load, and has wider output bandwidth. This board gives direct access to the LT5514’s output pins, and was used for stability tests. Higher VOSUP (7V) is required to compensate for the DC voltage drop on R1 and R2. Use TP2, TP3 to monitor the actual LT5514 output bias volt- age. By replacing R1 and R2 with inductors, this board can operate with a 5V supply. However, this may limit the minimum signal frequency. For example, an 820nH choke inductor will limit the lowest signal frequency to 40MHz. PACKAGE DESCRIPTIO FE Package 20-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663) Exposed Pad Variation CB FE20 (CB) TSSOP 0204 0.09 – 0.20 (.0035 – .0079) 0 ° – 8° 0.25 REF RECOMMENDED SOLDER PAD LAYOUT 0.50 – 0.75 (.020 – .030) 4.30 – 4.50* (.169 – .177) 13 4 5 6 7 89 10 11 12 14 13 6.40 – 6.60* (.252 – .260) 3.86 (.152) 2.74 (.108) 20 1918 17 16 15 1.20 (.047) MAX 0.05 – 0.15 (.002 – .006) 0.65 (.0256) BSC 0.195 – 0.30 (.0077 – .0118) TYP 2 2.74 (.108) 0.45 ±0.05 0.65 BSC 4.50 ±0.10 6.60 ±0.10 1.05 ±0.10 3.86 (.152) MILLIMETERS (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN 3. DRAWING NOT TO SCALE SEE NOTE 4 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT 6.40 (.252) BSC |
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