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DMTH6016LSD-13 bảng dữ liệu(PDF) 2 Page - Diodes Incorporated

tên linh kiện DMTH6016LSD-13
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DMTH6016LSD
Document number: DS38549 Rev. 3 - 2
2 of 7
www.diodes.com
January 2017
© Diodes Incorporated
DMTH6016LSD
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 6) VGS = 10V
TA = +25°C
TA = +100°C
ID
7.6
5.4
A
Continuous Drain Current (Note 6) VGS = 4.5V
TA = +25°C
TA = +100°C
ID
6.2
4.4
A
Pulsed Drain Current (10
μs pulse, duty cycle = 1%)
IDM
40
A
Maximum Continuous Body Diode Forward Current
IS
1.7
A
Pulsed Body Diode Forward Current (10
μs pulse, duty cycle = 1%)
ISM
40
A
Avalanche Current, L = 0.1mH
IAS
15.3
A
Avalanche Energy, L = 0.1mH
EAS
11.7
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
PD
1.4
W
Thermal Resistance, Junction to Ambient (Note 5)
RJA
103
°C/W
Total Power Dissipation (Note 6)
PD
1.9
W
Thermal Resistance, Junction to Ambient (Note 6)
RJA
77
°C/W
Thermal Resistance, Junction to Case
RJC
14.5
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +175
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
60
—
—
V
VGS = 0V, ID = 250µA
Zero Gate Voltage Drain Current
IDSS
—
—
1
µA
VDS = 48V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(TH)
1
—
2.5
V
VDS = VGS, ID = 250µA
Static Drain-Source On-Resistance
RDS(ON)
—
15
19.5
m
Ω
VGS = 10V, ID = 10A
—
21
28
VGS = 4.5V, ID = 6A
Diode Forward Voltage
VSD
—
0.7
1.2
V
VGS = 0V, IS = 1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
—
864
—
pF
VDS = 30V, VGS = 0V,
f = 1MHz
Output Capacitance
Coss
—
282
—
Reverse Transfer Capacitance
Crss
—
27
—
Gate Resistance
Rg
—
1.3
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 4.5V)
Qg
—
8.4
—
nC
VDS = 30V, ID = 10A
Total Gate Charge (VGS = 10V)
Qg
—
17
—
Gate-Source Charge
Qgs
—
3.1
—
Gate-Drain Charge
Qgd
—
4.3
—
Turn-On Delay Time
tD(ON)
—
3.4
—
ns
VGS = 10V, VDS = 30V,
RG = 6Ω, ID = 10A
Turn-On Rise Time
tR
—
5.2
—
Turn-Off Delay Time
tD(OFF)
—
13
—
Turn-Off Fall Time
tF
—
7
—
Reverse Recovery Time
tRR
—
22
—
ns
IF = 10A, di/dt = 100A/µs
Reverse Recovery Charge
QRR
—
11
—
nC
Notes:
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.



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