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DMTH6016LSD-13 bảng dữ liệu(PDF) 2 Page - Diodes Incorporated |
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DMTH6016LSD-13 bảng dữ liệu(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() DMTH6016LSD Document number: DS38549 Rev. 3 - 2 2 of 7 www.diodes.com January 2017 © Diodes Incorporated DMTH6016LSD Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 60 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 6) VGS = 10V TA = +25°C TA = +100°C ID 7.6 5.4 A Continuous Drain Current (Note 6) VGS = 4.5V TA = +25°C TA = +100°C ID 6.2 4.4 A Pulsed Drain Current (10 μs pulse, duty cycle = 1%) IDM 40 A Maximum Continuous Body Diode Forward Current IS 1.7 A Pulsed Body Diode Forward Current (10 μs pulse, duty cycle = 1%) ISM 40 A Avalanche Current, L = 0.1mH IAS 15.3 A Avalanche Energy, L = 0.1mH EAS 11.7 mJ Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 1.4 W Thermal Resistance, Junction to Ambient (Note 5) RJA 103 °C/W Total Power Dissipation (Note 6) PD 1.9 W Thermal Resistance, Junction to Ambient (Note 6) RJA 77 °C/W Thermal Resistance, Junction to Case RJC 14.5 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +175 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 60 — — V VGS = 0V, ID = 250µA Zero Gate Voltage Drain Current IDSS — — 1 µA VDS = 48V, VGS = 0V Gate-Source Leakage IGSS — — ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(TH) 1 — 2.5 V VDS = VGS, ID = 250µA Static Drain-Source On-Resistance RDS(ON) — 15 19.5 m Ω VGS = 10V, ID = 10A — 21 28 VGS = 4.5V, ID = 6A Diode Forward Voltage VSD — 0.7 1.2 V VGS = 0V, IS = 1A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 864 — pF VDS = 30V, VGS = 0V, f = 1MHz Output Capacitance Coss — 282 — Reverse Transfer Capacitance Crss — 27 — Gate Resistance Rg — 1.3 — Ω VDS = 0V, VGS = 0V, f = 1MHz Total Gate Charge (VGS = 4.5V) Qg — 8.4 — nC VDS = 30V, ID = 10A Total Gate Charge (VGS = 10V) Qg — 17 — Gate-Source Charge Qgs — 3.1 — Gate-Drain Charge Qgd — 4.3 — Turn-On Delay Time tD(ON) — 3.4 — ns VGS = 10V, VDS = 30V, RG = 6Ω, ID = 10A Turn-On Rise Time tR — 5.2 — Turn-Off Delay Time tD(OFF) — 13 — Turn-Off Fall Time tF — 7 — Reverse Recovery Time tRR — 22 — ns IF = 10A, di/dt = 100A/µs Reverse Recovery Charge QRR — 11 — nC Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. |
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