MB39C014 datasheet(9/32 Pages) CYPRESS

9 / 32 page

Document Number: 002-08361 Rev. *C

Page 9 of 32

MB39C014

6. Absolute Maximum Ratings

*1 : Power dissipation value between

+ 25°C and + 85°C is obtained by connecting these two points with a straight line

*2 : When mounted on a four- layer epoxy board of 11.7 cm × 8.4 cm

*3 : Connection at exposure pad with thermal via. (Thermal via 4 holes)

*4 : Connection at exposure pad, without a thermal via.

Notes:

■ The use of negative voltages below

− 0.3 V to the GND pin may create parasitic transistors on LSI lines, which can cause abnormal

operation.

■ This device can be damaged if the LX pin is short-circuited to VDD or GND.

■ Take measures not to keep the FSEL pin falling below the GND potential of this IC as much as possible.

In addition to erroneous operation, the IC may latch up and destroy itself if 110 mA or more current flows from this pin.

WARNING:

Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in

excess of absolute maximum ratings. Do not exceed these ratings.

Parameter

Symbol

Condition

Rating

Unit

Min

Max

Power supply voltage

VDD

VDD pin

− 0.3

+ 6.0

Signal input voltage

VISIG

OUT pin

− 0.3

VDD

+ 0.3

CTL, MODE, FSEL pins

− 0.3

VDD

+ 0.3

VREFIN pin

− 0.3

VDD

+ 0.3

POWERGOOD pull-up voltage

VIPG

POWERGOOD pin

− 0.3

+ 6.0

LX voltage

VLX

LX pin

− 0.3

VDD

+ 0.3

LX peak current

IPK

ILX

—1.8

Power dissipation

≤ + 25°C

—

2632*1, *2, *3

—980*1, *2, *4

= + 85 °C

—

1053*1, *2, *3

—392*1, *2, *4

Operating ambient temperature

—

− 40

+ 85

°C

Storage temperature

TSTG

—

− 55

+ 125

°C

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