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CYRF8935 bảng dữ liệu(PDF) 13 Page - Cypress Semiconductor |
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CYRF8935 bảng dữ liệu(HTML) 13 Page - Cypress Semiconductor |
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13 / 40 page ![]() CYRF8935 Document Number: 001-61351 Rev. *K Page 13 of 40 Setting the Radio Frequency Programming by channel number is the easiest way to set frequency. In the CYRF8935, RF carrier frequency and RF channel number are always related by the expression: Freq. = 2402 + Ch. # Channel number is loaded into bits [6:0] of Register 7. Bits 7 and 8 initiate the desired Rx or Tx operation, respectively. Some sample Register 7 examples are as shown in Table 4. During Regulatory Compliance testing, you can jump directly to another frequency any time without going through IDLE state. If you change between Tx and Rx, however, you must pass through IDLE state. For IDLE state, write Register 7 to clear bits 8 and 7. Tx or Rx operation is initiated when Register 7 bit 8 or 7 is set. Radio frequency is also determined at that time. Crystal Oscillator The CYRF8935 contains the on-chip gain block for the quartz crystal frequency standard. Quartz Crystal Application As shown in Figure 10 on page 14, the series resistor Rs limits power to the crystal and contributes to the phase-shift necessary for oscillation. The ideal Rs value may need to be determined empirically, adjusted for certain crystal manufacturer part numbers and designs. The series equivalent combinations of C1 and C2 largely determine the capacitive load seen by the crystal, which should match the crystal vendor's specification. These capacitor values are chosen to center the crystal oscillator frequency at the correct value, 12 MHz. The feedback resistor Rf from the buffer output to input serves to self-bias the on-chip buffer to the center of the linear region for maximum gain. Verifying correct crystal oscillator frequency may require special test methods. Because connecting a frequency counter probe to either XTALi or XTALo adds capacitive loading and alters the crystal oscillation frequency, other methods must be used. For bare die applications involving COB packaging, use the BRCLK[5] test point to verify correct frequency of oscillation. This requires register 32[3:1] set accordingly (see Register Defini- tions on page 21). For 24-QFN packaged parts, the correct crystal frequency is determined by transmitting a continuous carrier frequency (see Register Settings for Test Purposes on page 19) and using a RF frequency counter to ensure correct frequency. Irrespective of which method is used, initial tolerance should be within budget as recommended in Table 5, such that the total frequency error stays within budget. Note For proper operation, the total frequency error must not exceed what is shown in Table 5. Individual error contributions can be adjusted; for example 10+20+5+5=40, or 5+30+2+3=40. Table 4. Sample Register 7 Settings Carrier Frequency, MHz DUT Channel Number (decimal) DUT Channel Number (hex) Tx setting: Reg. 7 value for TX_EN= 1 Rx setting: Reg. 7 value for RX_EN= 1 2402 0 00 0100 0080 2403 1 01 0101 0081 2404 2 02 0102 0082 | | | | | 2434 32 20 0120 00A0 | | | | | 2441 39 27 0127 00A7 | | | | | 2480 78 4E 014E 00CE Table 5. Crystal Specifications Crystal Parameter Specification Frequency 12.000 MHz Initial frequency tolerance ±15 ppm Frequency tolerance over temperature ±15 ppm Frequency tolerance after aging ±5 ppm Frequency drift due to load cap. drift ±5 ppm Total ±40 ppm Equivalent series resistance 80 max Resonance mode Fundamental, parallel resonant Load capacitance In accordance with external load capacitors (see C1 and C2 in Figure 10) Note 5. BRCLK signal is available on bare die only, not packaged parts. |
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