Low Value 3W

Chip Resistors

LRF3W Series

Low Value 3W

Chip Resistors

LRF3W Series

Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com

04.10

Welwyn Components

85

Performance Data

Construction

Patented non-noble copper based thick film material,

overglaze and organic protection are screen printed on a 96%

alumina substrate. The components are laser trimmed to

achieve the required resistance tolerance.

Terminations

The wrap-around terminations have an electroplated nickel

barrier and matte tin finish, this ensures excellent ‘leach’

resistance properties and solderability.

Chips can withstand immersion in solder at 250°C for

90 seconds and are suitable for reflow or wave soldering

mounting applications.

Marking

The body protection and marking are resistant to all normal

industrial cleaning solvents suitable for printed circuits.

Chips are packed and mounted with marking side up.

The LRF3W Chips are mounted with the actual resistor

element mounted face down on its termination pads.

Packaging

LRF3W Resistors are supplied taped and reeled as per IEC 286-3. The standard quantity per reel is 1800 parts.

Notes:

1. Full AEC-Q200 qualification applies to ohmic values

Tape dimensions in mm

W

P1

P0

P2

D0

D1

E

F

A0

B0

K0

T

T1

T2

±0.3

±0.1

±0.1

±0.05

±0.1

±0.2

±0.1

±0.05

±0.1

±0.1

±0.1

±0.05

nom

±0.15

LRF3W

12

8

4

2

1.5

1.5

1.75

5.5

3.61

6.96

1.17

0.28

0.06

1.45

2.5

± 0.5

13

± 0.5

33

± 1.0

Marking

(Both sides)

0.8

± 0.15

13

± 0.5mm

T

AEC-Q200 Table 7

Method

Max.

(add R05)

Typ.

(@R20)

ref

Test

3

High Temp. Exposure

MIL-STD-202 Method 108

R%

0.5

0.2

4

Temperature Cycling

JESD22 Method JA-104

R%

0.25

0.1

6

Moisture Resistance

MIL-STD-202 Method 106

R%

0.5

0.2

7

Biased Humidity

MIL-STD-202 Method 103

R%

0.5

0.2

8

Operational Life (Cyclic Load)

MIL-STD-202 Method 108

R%

1

0.5

14

Vibration

MIL-STD-202 Method 204

R%

0.5

0.05

15

Resistance to Soldering Heat

MIL-STD-202 Method 210

R%

0.25

0.05

16

Thermal Shock

MIL-STD-202 Method 107

R%

0.25

0.1

18

Solderability

J-STD-002

>95% coverage

21

Board Flex

AEC-Q200-005

R%

0.5

0.2

22

Terminal Strength

AEC-Q200-006

R%

0.25

0.1

Short Term Overload

6.25 x Pr for 2s

R%

0.5

Low Temperature Storage

-65°C for 100 hours

R%

0.5

Shelf Life Test

Room temp for 12 months

R%

0.1

Leach Resistance

Solder dip at 250°C

90s minimum

0

20

40

60

80

100

0

20

40

60

80

100

120

140

160

Ambient Temperature (°C)

Temperature Derating

Thermal Data

10

100

100

1000

Temperature Rise

1W

3W

2W

11.17

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronics.com/resistors

BI Technologies IRC Welwyn