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XC6806

Series

●USP-10B Power Dissipation

Power dissipation data for the USP-10B is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as one of reference data taken in the described condition.

1. Measurement Condition (Reference data)

Condition： Mount on a board

Ambient： Natural convection

Soldering： Lead (Pb) free

1st lnner Metal Layer about 50%

2nd lnner Metal Layer does not exist

3rd lnner Metal Layer does not exist

4th lnner Metal Layer about 50%

Each heat sink back metal is connected to the

lnner layers respectively.

Material： Glass Epoxy（FR-4）

Thickness： 1.6mm

Through-hole： 4 × 0.8mm Diameter

Evaluation Board（Unit：mm）

2. Power Dissipation vs. Ambient temperature

Board Mount ( Tjmax = 125℃ )

Ambient Temperature（℃）

Power Dissipation Pd（mW）

Thermal Resistance (℃/W)

25

1000

100.00

85

400

0

200

400

600

800

1000

1200

25

45

65

85

105

125

Ambient Temperature Ta (℃)

Pd vs Ta

2.5

28.9

40.0