PC755 datasheet(38/50 Pages) ATMEL

tên linh kiện	PC755

Giải thích chi tiết về linh kiện	PowerPC 755/745 RISC Microprocessor

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PC755/745

2138D–HIREL–06/03

Figure 25. Mechanical Dimensions and Bottom Surface Nomenclature of the PC745 PBGA

Parameters for the PC755

PBGA

Package Parameter for the

PC755 PBGA

The package parameters are as provided in the following list. The package type is 25 x

25 mm, 360-lead plastic ball grid array (PBGA).

Package outline

25 x 25 mm

Interconnects

360 (19 x 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.22 mm

Maximum module height

2.77 mm

Ball diameter

0.75 mm (29.5 mil)

Table 1

Millimeters

DIM

Min

Max

2.25

2.80

0.50

0.70

1.00

1.20

0.60

0.90

21.00 BSC

1.27 BSC

0.2

A1 CORNER

0.2

0.15 C

255X

123456789 10 111213141516

0.3

0.15

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

4. CAPACITOR PADS MAY BE UNPOPULATED.

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