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DMNH6042SSDQ bảng dữ liệu(PDF) 2 Page - Diodes Incorporated

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DMNH6042SSDQ
Document number: DS37829 Rev. 4 - 2
2 of 7
www.diodes.com
August 2016
© Diodes Incorporated
DMNH6042SSDQ
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 7) VGS = 10V
Steady
State
TA = +25°C
TA = +70°C
ID
5.3
4.4
A
Steady
State
TC = +25°C
TC = +100°C
ID
16.7
14
A
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
IDM
35
A
Maximum Continuous Body Diode Forward Current (Note 7)
IS
2.3
A
Avalanche Current (Note 8) L = 10mH
IAS
3.5
A
Avalanche Energy (Note 8) L = 10mH
EAS
65
mJ
Thermal Characteristics
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 6)
PD
1.5
W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RθJA
100
°C/W
t<10s
61
Total Power Dissipation (Note 7)
PD
2.1
W
Thermal Resistance, Junction to Ambient (Note 7)
Steady State
RθJA
72
°C/W
t<10s
44
Thermal Resistance, Junction to Case (Note 7)
RθJC
7.25
Operating and Storage Temperature Range
TJ, TSTG
-55 to +175
°C
Electrical Characteristics (@TA= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
BVDSS
60
—
—
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
—
—
1
µA
VDS = 60V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
VGS(TH)
1.0
—
3.0
V
VDS = VGS, ID = 250µA
Static Drain-Source On-Resistance
RDS(ON)
—
34
50
m
Ω
VGS = 10V, ID = 5.1A
—
45
65
VGS = 4.5V, ID = 4.4A
Diode Forward Voltage
VSD
—
0.8
1.2
V
VGS = 0V, IS = 2.6A
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
CISS
—
584
—
pF
VDS = 25V, VGS = 0V,
f = 1.0MHz
Output Capacitance
COSS
—
83
—
pF
Reverse Transfer Capacitance
CRSS
—
24
—
pF
Gate Resistance
RG
—
3.8
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 4.5V)
QG
—
4.2
—
nC
VDS = 44V, ID = 5.2A
Total Gate Charge (VGS = 10V)
QG
—
8.8
—
nC
Gate-Source Charge
QGS
—
1.8
—
nC
Gate-Drain Charge
QGD
—
1.8
—
nC
Turn-On Delay Time
tD(ON)
—
3.4
—
ns
VGS = 10V, VDS = 30V,
RG = 6Ω, ID = 1A
Turn-On Rise Time
tR
—
1.9
—
ns
Turn-Off Delay Time
tD(OFF)
—
10.1
—
ns
Turn-Off Fall Time
tF
—
4.5
—
ns
Body Diode Reverse Recovery Time
tRR
—
12.9
—
ns
IF = 2.6A, di/dt = 100A/μs
Body Diode Reverse Recovery Charge
QRR
—
5.4
—
nC
Notes:
6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.
8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.



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