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EVB-USB2517 bảng dữ liệu(PDF) 4 Page - SMSC Corporation

tên linh kiện EVB-USB2517
Giải thích chi tiết về linh kiện  Hi-Speed (480 Mbits/s), Full-Speed (12 Mbits/s), and Low-Speed (1.5 Mbits/s) compatible
PDF  6 Pages
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nhà sản xuất  SMSC [SMSC Corporation]
Trang chủ  http://www.smsc.com
Logo SMSC - SMSC Corporation

EVB-USB2517 bảng dữ liệu(HTML) 4 Page - SMSC Corporation

  EVB-USB2517 Datasheet HTML 1Page - SMSC Corporation EVB-USB2517 Datasheet HTML 2Page - SMSC Corporation EVB-USB2517 Datasheet HTML 3Page - SMSC Corporation EVB-USB2517 Datasheet HTML 4Page - SMSC Corporation EVB-USB2517 Datasheet HTML 5Page - SMSC Corporation EVB-USB2517 Datasheet HTML 6Page - SMSC Corporation  
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EVB-USB2517 Evaluation Board User Manual (Revision A)
Revision 1.2 (1-7-09)
4
SMSC EVB-USB2517 Revision A
USER MANUAL
2.1.6
Connector Description
The EVB-USB2517 has a set of standard USB style connectors:
One type B connector for the upstream port
Seven type A connectors for downstream ports
Power is supplied via a 2.0 mm power jack. Please refer to Table 2.1 for a list of the connectors. For
more details on the pinout of the connectors please refer to the schematics in Figure 2.1 and
Figure 2.2.
2.1.7
Layout Considerations
The EVB-USB2517 is a low-power, hi-speed USB 2.0 compliant hub on four PCB layers. Please refer
to Table 2.2 for a list of the PCB layer stackup. Differential signals from the USB2517 match the
upstream and downstream port placement to simplify the routing of critical signals.
The top layer of the component side is shown in Figure 2.1. The schematic includes silk screen
information to identify component locations.
Table 2.1 Connector Descriptions
CONNECTOR
TYPE
DESCRIPTION
J0
USB B
Upstream Port
J1
USB A
Downstream Port 1
J2
USB A
Downstream Port 2
J3
USB A
Downstream Port 3
J4
USB A
Downstream Port 4
J5
USB A
Downstream Port 5
J6
USB A
Downstream Port 6
J7
USB A
Downstream Port 7
J8
Power Jack 2.0 mm
+5 V Power Supply
Table 2.2 PCB Layer Stackup
COMPONENT SIDE
Solder mask
Layer 1
1.3 - 2.3 oz., finished
Pre-preg
4.0 - 4.5 mil FR-4
Layer 2
1.0 oz., nominal
Core
28 mil FR-4
Layer 3
1.0 oz., nominal
Pre-preg
4.0 - 4.5 mil FR-4
Layer 4
1.3 - 2.3 oz., finished
Solder mask
Solder Side



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