PS5164 datasheet(2/10 Pages) MICROCHIP

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PS5164

DS21850B-page 2

 2004 Microchip Technology Inc.

1.0

GENERAL DESCRIPTION

The PS5164 module is a complete smart battery

controller subsystem based on the Microchip PS501

field reprogrammable battery manager with patented

Accuron® technology. The module is designed to

operate in a battery pack consisting of four (4) series

connected Li-based cells. The module consists of the

Microchip PS501 battery manager IC with a four-LED

SOC display and an optional connection for an external

thermistor.

1.1

Quick Start – Pack Assembly

Follow these directions to assemble a pack with the

PS5164 module.

• Use standard precautions when handling static

sensitive devices.

• Modules should be connected to battery cells in

the order indicated below to insure proper start-up

and operation. Wires should be attached to the

modules first and then connected to the battery

cells as instructed.

• The connection sequence is critical to successful

use of the PS501 family of CMOS ASICs. The

pack positive should be securely connected to the

module first, followed by the intermediate cells

from most positive to least positive and finally,

pack negative.

Step 1)

Configure the module for optional external

thermistor use. PS5164 modules are shipped

configured to use the internal temperature

sensor only. To add an external thermistor to

the board, remove resistor R16 (side 2) and

connect the thermistor across via TN and TR.

Step 2)

Connect wires to module. Use large diameter

wire (18 AWG-20 AWG) for current carrying

lines from VR, V1, B+ and BN. All others are

signal only lines (24 to 22 AWG).

Step 3)

Connect external connector to BN, T, C, D

and B+.

Step 4)

Connect V1 to the most positive point on the

battery cell stack.

Step 5)

Connect the negative end of the top-most cell

to V2, the negative end of the next cell to V3

and the negative end of the third cell to V4.

Step 6)

Connect VR to the most negative point on the

battery cell stack.

Step 7)

Program

the

assembled

pack

using

Microchip’s software and PowerCal™ board

or PowerInfo™ board hardware.

The memory parameters can be changed at

will using the utilities on the memory page in

the software.

Step 8)

Calibrate the pack using the software and

PowerCal™ board hardware. The pack is

now ready for use.

FIGURE 1-1:

CONNECTION POINTS (SIDE 1)

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