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DMN60H080DS-7 bảng dữ liệu(PDF) 2 Page - Diodes Incorporated |
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DMN60H080DS-7 bảng dữ liệu(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() DMN60H080DS Document number: DS39475 Rev. 3 - 2 2 of 7 www.diodes.com May 2017 © Diodes Incorporated DMN60H080DS Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 600 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 5) VGS = 10V Steady State TA = +25°C TA = +70°C ID 70 56 mA Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +70°C ID 80 70 mA Continuous Drain Current (Note 5) VGS = 4.5V Steady State TA = +25°C TA = +70°C ID 40 32 mA Continuous Drain Current (Note 6) VGS = 4.5V Steady State TA = +25°C TA = +70°C ID 50 40 mA Pulsed Drain Current @ TSP = +25°C (Note 7) IDM 0.2 A Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation, @TA = +25°C (Note 5) PD 0.70 W Thermal Resistance, Junction to Ambient @ TA = +25°C (Note 5) RθJA 174 °C/W Power Dissipation, @TA = +25°C (Note 6) PD 1.10 W Thermal Resistance, Junction to Ambient @ TA = +25°C (Note 6) RθJA 99 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 8) Drain-Source Breakdown Voltage BVDSS 600 — — V VGS = 0V, ID = 250µA Zero Gate Voltage Drain Current TJ = +25°C IDSS — — 1 µA VDS = 600V, VGS = 0V Gate-Body Leakage IGSS — — ±10 µA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage VGS(TH) 1.5 — 3.0 V VDS = VGS, ID = 250µA 1.5 — 2.6 V VDS = VGS, ID = 8µA Static Drain-Source On-Resistance RDS(ON) — 67 100 Ω VGS = 10V, ID = 60mA — 95 290 VGS = 4.5V, ID = 60mA Forward Transfer Admittance |Yfs| — 76 — ms VDS = 10V, ID = 60mA Diode Forward Voltage VSD — — 1.5 V VGS = 0V, IS = 50mA DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Ciss — 25 — pF VDS = 25V, VGS = 0V, f = 1.0MHz Output Capacitance Coss — 5.2 — Reverse Transfer Capacitance Crss — 1.4 — Total Gate Charge Qg — 1.7 — nC VGS = 10V, VDD = 300V, ID = 0.01A Gate-Source Charge Qgs — 0.3 — Gate-Drain Charge Qgd — 0.9 — Turn-On Delay Time tD(ON) — 7 — ns VDD = 300V, VGS = 10V, RGEN = 3.3Ω, ID = 60mA Turn-On Rise Time tR — 10 — ns Turn-Off Delay Time tD(OFF) — 21 — ns Turn-Off Fall Time tF — 158 — ns Reverse Recovery Time tRR — 189.1 — ns VR =300V, IF =0.06A, di/dt = 100A/µs Reverse Recovery Charge QRR — 32 — nC Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided. 6 . Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided. 7. Repetitive rating, pulse width limited by junction temperature, 10µs pulse, duty cycle = 1%. 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to production testing. |
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