TSL1401CS

128 × 1 LINEAR SENSOR ARRAY WITH HOLD

TAOS036A - AUGUST 2003

12

r

r

Copyright

E 2003, TAOS Inc.

The

LUMENOLOGY

r Company

www.taosinc.com

MANUFACTURING INFORMATION

This product has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The

process, equipment, and materials used in these tests are detailed below.

Tooling Required

Process

1.

Apply solder paste using stencil

2.

Dispense adhesive dots

3.

Place component

4.

Reflow solder/cure

5.

X-Ray verify

Placement of the TSL1401CS device onto the gold immersion substrate is accomplished using a standard

surface mount manufacturing process. First, using the stencil with 0.36 mm square aperture, print solder paste

onto the substrate. Next, dispense two 0.25 mm to 0.4 mm diameter dots of adhesive in opposing corners of

the TSL1401CS mounting area. Machine place the TSL1401CS from the JEDEC waffle carrier onto the

substrate. A suggested pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has

a rubber tip with a diameter of approximately 0.75 mm. The part is picked up from the center of the body. Reflow

the solder and cure the adhesive using the solder profile shown in Figure 15.

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Figure 15. TSL1401CS Solder Profile

It is important to use a substrate that has an immersion plating surface. This may be immersion gold, silver, or

white tin. Hot air solder leveled substrates (HASL) are not coplanar and should not be used.