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ATL25SeriesASIC

1414C–ASIC-08/02

Advanced

Packaging

The ATL25 Series ASICs are offered in a wide variety of standard packages, including plastic

and ceramic quad flatpacks, thin quad flatpacks, ceramic pin grid arrays and ball grid arrays.

High-volume onshore and offshore contractors provide assembly and test for commercial

product, with prototype capability in Colorado Springs. Custom package designs are also

available as required to meet a customer’s specific needs, and are supported through Atmel’s

package design center. If a standard package cannot meet a customer’s needs, a package

can be designed to precisely fit the customer-specific application and to maintain the perfor-

mance obtained in silicon. Atmel has delivered custom-designed packages in a wide variety of

configurations.

Note:

1. Require customer design substrate.

Table 7. Packaging Options–Partial List

Package Type

Pin Count

PQFP

44, 52, 64, 80, 100, 120, 128, 132, 144, 160, 184, 208, 240, 304

Power Quad

144, 160, 208, 240, 304

L/TQFP

32, 44, 48, 64, 80, 100, 120, 128, 144, 160, 176, 216

PLCC

20, 28, 32, 44, 52, 68, 84

CPGA

64, 68, 84, 100, 124, 144, 155, 180, 223, 224, 299, 391

CQFP

64, 68, 84, 100, 120, 132, 144, 160, 224, 340

PBGA

121, 169, 208, 217, 225, 240, 256, 272, 300, 304, 313, 316, 329, 352, 388, 420, 456

Super BGA

168, 204, 240, 256, 304, 352, 432, 560, 600

Low-profile Mini BGA

40, 48, 49, 56, 60, 64, 80, 81, 84, 96, 100, 108, 128, 132, 144, 160, 176, 192, 208, 224, 228

Chip-scale BGA

32, 36, 40, 48, 49, 56, 64, 81, 84, 100, 108, 121, 128, 144, 160, 169, 176, 192, 208, 224, 256, 288, 324

Flex-tape BGA

48, 49, 64, 80, 81, 84, 96, 100, 112, 132, 144, 156, 160, 180, 192, 196, 204, 208, 220, 225, 228, 256, 280

FCBGA

(1)

416, 480, 564, 672, 788, 896, 960, 1032, 1152, 1157, 1292, 1357, 1413, 1500, 1517, 1557, 1677, 1728,

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