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SST12CP12 bảng dữ liệu(PDF) 11 Page - Microchip Technology

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SST12CP12 bảng dữ liệu(HTML) 11 Page - Microchip Technology

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 2013 Microchip Technology Inc.
DS70005124B-page 11
SST12CP12
7.0
PACKAGE INFORMATION
FIGURE 7-1:
16-CONTACT ULTRA-THIN QUAD FLAT NO-LEAD (UQFN)
PACKAGE CODE: QUC
Note: 1. Complies with JEDEC JEP95 MO-248D, variant UEED-4 except external paddle nominal dimensions.
2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.
3. The external paddle is electrically connected to the die back-side and possibly to certain VSS leads.
This paddle can be soldered to the PC board; it is suggested to connect this paddle to the VSS of the unit.
Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
16-uqfn-3x3-QUC-0.0
1.7
0.5 BSC
See notes
2 and 3
Pin #1
0.30
0.18
0.075
1.7
0.15
0.05 Max
0.45
0.35
0.60
0.50
Pin #1
TOP VIEW
BOTTOM VIEW
SIDE VIEW
1mm
3.00
± 0.075
3.00
± 0.075
TABLE 7-1:
REVISION HISTORY
Revision
Description
Date
A
•
Initial release of data sheet
Apr 2013
B
•
Updated Table 4-2 on page 5
•
Revised Figure 6-5 on page 10
Sep 2013



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