| nhà sản xuất | tên linh kiện | bảng dữ liệu | Giải thích chi tiết về linh kiện |
Molex Electronics Ltd. |
0015800201
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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0015800207
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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0015912200
|
1Mb / 8P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
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0879200830
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1Mb / 12P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
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0879209311
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1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Overall Plating, with Cap, without Peg, Tape on Reel Packaging, Lead-free
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0879200833
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1Mb / 16P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap, without Peg
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0879208115
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1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
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0879209346
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1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 34 Circuits, Tin (Sn) Overall Plating, without Cap, without Peg, Tube Packaging, Lead-free
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0879200014
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap
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15-91-2200
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35Kb / 2P |
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
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