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Molex Electronics Ltd. |
0015800541
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, Tin (Sn) Plating
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0015800449
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1Mb / 7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature
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0015800103
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
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0015800243
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits
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0015800643
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits
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0015800365
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits
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0015800343
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits
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0015800183
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1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits
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0015800363
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits
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15-80-0541
|
40Kb / 2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, Tin (Sn) Plating
|
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