Description
The I3G4250D is a low-power 3-axis angular rate sensor able to provide unprecedented stability at zero-rate level and sensitivity over temperature and time. It includes a sensing element and an IC interface capable of providing the measured angular rate to the application through a standard SPI digital interface. An I2C compatible interface is also available. The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers. The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The I3G4250D has a selectable full scale (±245/±500/±2000 dps) and is capable of measuring rates with a user-selectable bandwidth. The I3G4250D is available in a plastic land grid array (LGA) package and can operate within a temperature range of -40 °C to +85 °C. /*$ [[PP

Description
The LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. The LSM6DSM fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary dedicated lowpass filtering. High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSM is available in a plastic land grid array (LGA) package. LGA-14L (2.5 x 3 x 0.83 mm) typ.