FEATURES

· Glass passivated chip junction

· Low forward voltage drop

· Low reverse leakage

· High forward surge current capability

· High temperature soldering guaranteed: 260℃/10 secods,0.375”(9.5mm)lead length at 5 lbs(2.3kg) tension

MECHANICAL DATA

· Case: Transfer molded plastic

· Epoxy: UL94V-0 rate flame retardant

· Polarity: Color band denotes cathode end

· Lead: Plated axial lead, solderable per MIL-STD-202E method 208C

· Mounting position: Any

· Weight: 0.007ounce, 0.20 grams