▪ Single 1.65 V - 1.95 V supply
▪ Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) compatible support
• Supports SPI Modes 0 and 3
• Supports SPI dual output operations (1-1-2)
• Supports Quad output operations (1-1-4)
• Supports Quad I/O / XiP operations (1-4-4, 0-4-4)
• Supports QPI I/O operations (4-4-4)
▪ Read Operations
• Fast Read up to 133 MHz with 30 pF load
• Clock-to-Output (tV1/tCLQV) of 6 ns
• Up to 266 Mb/s continuous data transfer rate (Dual I/O)
• Up to 532 Mb/s continuous data transfer rate (Quad I/O and QPI)
• XiP (eXecute in Place) operation: continuous read with 8/16/32/64-byte wrap
▪ Full Chip Erase
▪ Flexible Erase Architecture and Time
• 20 ms Typical 4-kB Block Erase Time (Typical)
• 85 ms Typical 32-kB Block Erase Time (Typical)
• 160 ms Typical 64-kB Block Erase Time (Typical)
▪ Flexible Programming and Time
• Byte/Page Program (1 to 256 Bytes)
• Dual or Quad Input Byte/Page Program (1 to 256 Bytes)
▪ Erase/Program Suspend and Resume
▪ JEDEC Standard Manufacturer and Device ID
▪ Memory Protection Support
• User-Definable Protected Area at Start or End of Memory Array
• Enable/Disable Protection with WP Pin
▪ 3 x 1024-Byte One-Time Programmable (OTP) Security Registers
▪ Serial Flash Discoverable Parameters (SFDP) Register
▪ Low Power Dissipation
• 0.3 μA Deep Power-Down Current (Typical)
• 7.5 μA Standby current (Typical)
• 2 mA Active Read Current (80 MHz Typical)
▪ Endurance: 100,000 program/erase cycles (4-kB, 32-kB, or 64-kB blocks)
▪ Data Retention: 20 Years
▪ Temperature Range: -40 °C to +85 °C (Industrial)
▪ Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
• 8-pad 2 x 3 x 0.6 mm DFN
• 8-pad, 3 x 4 x 0.6 mm DFN
• 8-pad, 6 x 5 x 0.6 mm DFN
• 8-lead, 208-mil Wide and 150-mil Narrow SOIC
• 8-ball, WLCSP