DESCRIPTION
Halide-free activated foam flux conforming to DIN EN 29454-1 1.1.3 (former DIN 8511 F-SW32) with non-corrosive residues
as per DIN 8527 F-SW32. Stannol 500-14 is a ready to use foam flux for wave soldering machines and has been specially
formulated for applications in the electronic industry for soldering of printed circuits. The residues on printed circuit boards
are dry and fast to handle immediately after the soldering process. During circuit testing test needles do not get clogged, so
that cleaning of the boards is not required.
APPLICATION
During the soldering process most of the flux is rinsed off the PCBs. Should cleaning be desired, the remaining flux residues
can be easily removed using an alkaline cleaner. All known cleaning processes, such as by brushing, ultrasonic, steam etc.
are appropriate.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.