| nhà sản xuất | tên linh kiện | bảng dữ liệu | Giải thích chi tiết về linh kiện |
Schurter Inc. |
231683
|
195Kb / 1P |
Clip, 5 x 20 mm, Version 3
|
ON Semiconductor |
CAT3603
|
168Kb / 11P |
3-Channel LED Driver in 3 x 3 mm Package
January, 2010 ??Rev. 5 |
Analog Devices |
CP-8-9
|
253Kb / 1P |
8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 3 x 3 mm Body, Very Thin, Dual Lead
|
ILSI America LLC |
38-BX0F12.5-32.768
|
51Kb / 2P |
2 Lead Metal Package Crystal, 3 mm x 8 mm, 2 mm x 6 mm, 1 mm x 5 mm
|
|
39-BB0F18-20.000
|
49Kb / 2P |
2 Lead Metal Package Quartz Crystal, 3 mm x 10 mm
|
|
ZTTS
|
54Kb / 2P |
2 Pad and 3 Pad Ceramic Package, 3.4 mm x 7.4 mm and 4.1 mm x 4.7 mm
|
|
ZTTS-MG
|
56Kb / 2P |
2 Pad and 3 Pad Ceramic Package, 3.4 mm x 7.4 mm and 4.1 mm x 4.7 mm
|
Texas Instruments |
LMZM23600
|
1,006Kb / 36P |
36-V, 0.5-A Step-Down DC-DC Power Module in 3.8-mm x 3-mm Package
|
Schurter Inc. |
231683
|
206Kb / 2P |
Clip, 5 x 20 mm, Version 3
|
NXP Semiconductors |
NAFE11388
|
226Kb / 7P |
thermal enhanced very thin quad flat package, no leads, dimple wettable flank; 64 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body
Rev. 1-29 December 2021 |
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