Features
• ACEPACK 2 power module
– Triple boost switch 49 mΩ of typical RDS(on)
– Half-bridge switch 23.5 mΩ of typical RDS(on)
– Insulation voltage 2.5 kVrms
– Integrated NTC temperature sensor
– Integrated DC link capacitor
– DBC Cu-Al2O3-Cu based
– Press-fit contact pins

Application
• DC-DC converters
• Solar inverters

Description
This power module realizes a triple boost plus half-bridge topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.