KEY FEATURES:

‹ M AXIMIZES THROUGHPUT with
velocity to 2 m/s & acceleration to 5 g
‹ Incorporates active yaw &
orthogonality control for MAXIMUM
PRECISION
‹ IMPROVES TURNAROUND TIME
with dual linear-motor H-bridge design
‹ Maintains thermal stability with
optional AIR- & WATER-COOLING
FEATURES for optimal performance
‹ Optimizes move-and-settle time &
contouring performance with available
ENHANCED THROUGHPUT
MODULE
‹ Available with LASER
INTERFEROMETER FEEDBACK for
best performance at the wafer plane