1 Features
• Available in the Texas Instruments NanoFree™
Package
• VCC Isolation
• 2-Rail Design
• I/Os are 4.6V Tolerant
• Partial Power-Down-Mode Operation
• Bus Hold on Data Inputs
• Maximum Data Rates
– 500Mbps (1.8V to 3.3V)
– 320Mbps (< 1.8V to 3.3V)
– 320Mbps (Level-Shifting to 2.5V or 1.8V)
– 280Mbps (Level-Shifting to 1.5V)
– 240Mbps (Level-Shifting to 1.2V)
• Latch-Up Performance Exceeds 100mA Per JESD
78, Class II
• ESD Protection Exceeds JESD 22

2 Applications
• Smartphone
• Servers
• Desktop PCs and Notebooks
• Other Portable Devices

3 Description
This 2-bit non-inverting bus transceiver uses two
separate configurable power-supply rails. The A ports
are designed to track VCCA and accepts any supply
voltage from 1.2V to 3.6V. The B ports are designed
to track VCCB and accepts any supply voltage from
1.2V to 3.6V. This allows for universal low-voltage
bidirectional translation and level-shifting between any
of the 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V voltage nodes.
The SN74AVCH2T45 is designed for asynchronous
communication between two data buses. The logic
levels of the direction-control (DIR pin) input activate
either the B-port outputs or the A-port outputs. The
device transmits data from the A bus to the B bus
when the B-port outputs are activated and from
the B bus to the A bus when the A-port outputs
are activated. The SN74AVCH2T45 features active
bus-hold circuitry, which holds unused or un-driven
inputs at a valid logic state. TI does not recommend
using pull-up or pull-down resistors with the bus-hold
circuitry.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables
the outputs, preventing damaging current backflow
through the device when it is powered down. The VCC
isolation feature ensures that if either VCC input is at
GND, then both outputs are in the high-impedance
state. The bus-hold circuitry on the powered-up side
always stays active.
Active bus-hold circuitry holds unused or un-driven
inputs at a valid logic state. NanoFree package
technology is a major breakthrough in IC packaging
concepts, using the die as the package.