FEATURES
• Industry Standard Serial Interface
- IS25LP256D: 256Mbit/32Mbyte
- IS25WP256D: 256Mbit/32Mbyte
- 3 or 4 Byte Addressing Mode
- Supports Standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
- Software & Hardware Reset
- Supports Serial Flash Discoverable
Parameters (SFDP)
• High Performance Serial Flash (SPI)
- 80MHz Normal Read
- Up to166Mhz Fast Read:
-166MHz at Vcc=2.7V to 3.6V (1)
-133MHz at Vcc=2.3V to 3.6V
-133MHz at Vcc=1.65V to 1.95V (2)
- Up to 80MHz DTR (Dual Transfer Rate)
- Equivalent Throughput of 664 Mb/s
- Selectable Dummy Cycles
- Configurable Drive Strength
- Supports SPI Modes 0 and 3
- More than 100,000 Erase/Program Cycles
- More than 20-year Data Retention
• Flexible & Efficient Memory Architecture
- Chip Erase with Uniform Sector/Block
Erase (4/32/64 Kbyte)
- Program 1 to 256 Byte per Page
- Program/Erase Suspend & Resume
• Efficient Read and Program modes
- Low Instruction Overhead Operations
- Continuous Read 8/16/32/64 Byte
Burst Wrap
- Selectable Burst Length
- AutoBoot Operation
• Low Power with Wide Temp. Ranges
- Single Voltage Supply
IS25LP: 2.30V to 3.60V
IS25WP: 1.65V to 1.95V
- 7.5 mA Active Read Current
- 10 μA Standby Current
- 1 μA Deep Power Down
- Temp Grades:
Extended: -40°C to +105°C
Auto Grade (A3): -40°C to +125°C
• Advanced Security Protection
- Software and Hardware Write Protection
- Advanced Sector/Block Protection
- Top/Bottom Block Protection
- Power Supply Lock Protection
- 4x256 Byte Dedicated Security Area
with OTP User-lockable Bits
- 128 bit Unique ID for Each Device
(Call Factory)
• Industry Standard Pin-out & Packages
- M =16-pin SOIC 300mil
- L = 8-contact WSON 8x6mm
- J = 8-contact WSON 8x6mm (3)
- G = 24-ball TFBGA (4x6 ball array)
- H = 24-ball TFBGA (5x5 ball array)
- W = KGD (Call Factory)
- Halogen-Free, RoHS & TSCA Compliant