State-of-the-Art EPIC-IIBE BiCMOS Design
Significantly Reduces Power Dissipation
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
Typical VOLP (Output Ground Bounce)
< 1 V at VCC = 5 V, TA = 25°C
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Ceramic Flat (W) Package, and Plastic (NT)
and Ceramic (JT) DIPs

description
These devices consist of bus-transceiver circuits,
D-type flip-flops, and control circuitry arranged for
multiplexed transmission of data directly from the
data bus or from the internal storage registers.
Output-enable (OEAB and OEBA) inputs are
provided to control the transceiver functions.
Select-control (SAB and SBA) inputs are provided
to select either real-time or stored data for
transfer. The circuitry used for select control
eliminates the typical decoding glitch that occurs
in a multiplexer during the transition between
stored and real-time data. A low input selects
real-time data, and a high input selects stored
data. Figure 1 illustrates the four fundamental
bus-management functions that can be
performed with the ’ABT652A.
Data on the A- or B-data bus, or both, can be stored in the internal D-type flip-flops by low-to-high transitions
at the appropriate clock (CLKAB or CLKBA) inputs, regardless of the select- or enable-control inputs. When SAB
and SBA are in the real-time transfer mode, it is possible to store data without using the internal D-type flip-flops
by simultaneously enabling OEAB and OEBA. In this configuration, each output reinforces its input. When all
other data sources to the two sets of bus lines are at high impedance, each set of bus lines remains at its last
state.
To ensure the high-impedance state during power up or power down, OEBA should be tied to VCC through a
pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver
(B to A). OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is
determined by the current-sourcing capability of the driver (A to B).