1 Features
1• Qualified for Automotive Applications
• AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Range
– Device HBM Classification Level 3A
– Device CDM Classification Level C6
• Signaling Rate: 25 Mbps
• Integrated Noise Filter at the Input
• Default Output High and Low Options
• Low Power Consumption: Typical ICC
– 1.9 mA at 1 Mbps, 3.8 mA at 25 Mbps (5-V
Supplies)
– 1.4 mA at 1 Mbps, 2.6 mA at 25 Mbps (3.3-V
Supplies)
• Low Propagation Delay: 32 ns Typical (5-V
Supplies)
• 65-kV/μs Transient Immunity, Typical (5-V
Supplies)
• Robust Electromagnetic Compatibility (EMC)
– System-level ESD, EFT, and Surge Immunity
– Low Emissions
• Isolation Barrier Life: > 25 Years
• Operates from 3.3-V and 5-V Supplies
• 3.3-V and 5-V Level Translation
• Narrow Body SOIC-8 Package
• Safety and Regulatory Approvals:
– 4242-V PK Isolation per DIN V VDE V 0884-10
and DIN EN 61010-1
– 3000-VRMS Isolation for 1 minute per UL 1577
– CSA Component Acceptance Notice 5A,
IEC 60950-1 and IEC 61010-1 End Equipment
Standards
– Planned CQC Certification per GB4943.1-2011

2 Applications
• Opto-Coupler Replacement in:
– Industrial FieldBus
– ProfiBus
– ModBus
– DeviceNet™ Data Buses
– Servo Control Interface
– Motor Control
– Power Supplies
– Battery Packs

3 Description
The ISO7310-Q1 device provides galvanic isolation
up to 3000 VRMS for 1 minute per UL 1577 and 4242
VPK per VDE V 0884-10. These devices have one
isolated channel comprised of a logic input and output buffer separated by a silicon dioxide (SiO2)
insulation barrier. Used in conjunction with isolated
power supplies, the ISO7310-Q1 device prevents
noise currents on a data bus or other circuit from
entering the local ground and interfering with or
damaging sensitive circuitry. The device has integrated noise filters for harsh industrial
environment where short noise pulses may be
present at the device input pins.
The ISO7310-Q1 device has TTL input thresholds
and operate from 3-V to 5.5-V supply levels. Through
innovative chip design and layout techniques, electromagnetic compatibility of the ISO7310-Q1
device has been significantly enhanced to enable
system-level ESD, EFT, Surge and Emissions
compliance.