FEATURES
 Clock frequency up to 400MHz
 8 internal banks for concurrent operation
 4‐bit prefetch architecture
 Programmable CAS Latency: 3, 4, 5, 6 and 7
 Programmable Additive Latency: 0, 1, 2, 3, 4, 5
and 6
 Write Latency = Read Latency‐1
 Programmable Burst Sequence: Sequential or
Interleave
 Programmable Burst Length: 4 and 8
 Automatic and Controlled Precharge Command
 Power Down Mode
 Auto Refresh and Self Refresh
 Refresh Interval: 7.8 s (8192 cycles/64 ms)
 ODT (On‐Die Termination)
 Weak Strength Data‐Output Driver Option
 Bidirectional differential Data Strobe (Singleended
data‐strobe is an optional feature)
 On‐Chip DLL aligns DQ and DQs transitions with
CK transitions
 DQS# can be disabled for single‐ended data
strobe
 Read Data Strobe supported (x8 only)
 Differential clock inputs CK and CK#
 VDD and VDDQ = 1.8V ± 0.1V
 PASR (Partial Array Self Refresh)
 SSTL_18 interface
 tRAS lockout supported
 Operating temperature:
Commercial (TA = 0°C to 70°C ; TC = 0°C to 85°C)
Industrial (TA = ‐40°C to 85°C; TC = ‐40°C to 95°C)
Automotive, A1 (TA = ‐40°C to 85°C; TC = ‐40°C to 95°C)
Automotive, A2 (TA = ‐40°C to 105°C; TC = ‐40°C to
105°C)