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CFP15 bảng dữ liệu (PDF) - Amkor Technology

CFP15 Datasheet PDF - Amkor Technology
tên linh kiện CFP15
tải về  CFP15 tải về
kích thước tập tin   593.78 Kbytes
Page   2 Pages
nhà sản xuất  AMKOR [Amkor Technology]
Trang chủ  http://www.amkor.com
Logo AMKOR - Amkor Technology
Giải thích chi tiết về linh kiện The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.

CFP15 Datasheet (PDF)

Go To PDF Page tải về bảng dữ liệu
CFP15 Datasheet PDF - Amkor Technology

tên linh kiện CFP15
tải về  CFP15 Click to download

kích thước tập tin   593.78 Kbytes
Page   2 Pages
nhà sản xuất  AMKOR [Amkor Technology]
Trang chủ  http://www.amkor.com
Logo AMKOR - Amkor Technology
Giải thích chi tiết về linh kiện The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.

CFP15 bảng dữ liệu (HTML) - Amkor Technology


CFP15 Thông tin chi tiết sản phẩm

FEATURES
Cu connector structure to reduce inductance and resistance
Enhanced thermal properties
Turnkey with test and packing services
Green materials: Pb-free plating & halogen-free mold compound

Application
With both 2 and 3 lead versions available, the PSMC package is suitable for high‑efficiency diode as well as transistor applications.
Schottky Barrier Diodes (SBDs)
Rectifier & Zener Diodes
Transient Voltage Suppressors (TVS)
MOSFETs




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Giới thiệu về Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

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