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FCIP bảng dữ liệu (PDF) - Amkor Technology
FCIP Datasheet PDF - Amkor Technology
tên linh kiện FCIP
tải về  FCIP tải về
kích thước tập tin   1242.94 Kbytes
Page   4 Pages
nhà sản xuất  AMKOR [Amkor Technology]
Trang chủ  http://www.amkor.com
Logo AMKOR - Amkor Technology
Giải thích chi tiết về linh kiện Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry.

FCIP Datasheet (PDF)

Go To PDF Page tải về bảng dữ liệu
FCIP Datasheet PDF - Amkor Technology

tên linh kiện FCIP
tải về  FCIP Click to download

kích thước tập tin   1242.94 Kbytes
Page   4 Pages
nhà sản xuất  AMKOR [Amkor Technology]
Trang chủ  http://www.amkor.com
Logo AMKOR - Amkor Technology
Giải thích chi tiết về linh kiện Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry.

FCIP bảng dữ liệu (HTML) - Amkor Technology


FCIP Thông tin chi tiết sản phẩm

Features
Incorporates standard JEDEC pitches and CSP solder ball diameters
Compatible with standard SMT assembly and test techniques
Utilizes cost-effective thin film redistribution technologies
Backside laser mark compatible
No need for underfill in most applications
Full turnkey CSPnl processing including test and tape & reel support
Eutectic lead-free solder balls
Available with polyimide repassivation
Qualified and in volume production
Proven reliability; exceeds all current handset mechanical reliability tests including drop, bend and key punch




Số phần tương tự - FCIP

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
Turck, Inc.		 FCI-1/4TCD04A4P-LIX-H1141 TURCK-FCI-1/4TCD04A4P-LIX-H1141 Datasheet
137Kb / 2P		 Flow Monitoring – Inline Sensor with Integrated Processor
11/07/2023
logo
Gamewell-FCI by Honeywe...		 FCI-CR-D4B GAMEWELL-FCI-FCI-CR-D4B Datasheet
59Kb / 1P		 Door, lock & key
FCI-CR-D4BR GAMEWELL-FCI-FCI-CR-D4BR Datasheet
59Kb / 1P		 Door, lock & key
logo
Turck, Inc.		 FCI-D03A4-NA-H1141/M16 TURCK-FCI-D03A4-NA-H1141/M16 Datasheet
102Kb / 1P		 Flow Monitoring – Inline Sensor without Integrated Processor
11/07/2023
FCI-D04A4P-AP8X-H1141 TURCK-FCI-D04A4P-AP8X-H1141 Datasheet
1Mb / 2P		 Flow Monitoring – Inline Sensor with Integrated Processor
11/07/2023
More results


Mô tả tương tự - FCIP

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
CITIZEN ELECTRONICS CO....		 CM155 CITIZEN-CM155 Datasheet
134Kb / 2P		 Being of the ultra-miniature SMD type
logo
PHOENIX CONTACT		 2908786 PHOENIX-2908786 Datasheet
49Kb / 2P		 Inexpensive as a result of reducing the number of separate housing parts
2959298 PHOENIX-2959298 Datasheet
56Kb / 3P		 Inexpensive as a result of reducing the number of separate housing parts
2959340 PHOENIX-2959340 Datasheet
50Kb / 2P		 Inexpensive as a result of reducing the number of separate housing parts
2959476 PHOENIX-2959476 Datasheet
49Kb / 2P		 Inexpensive as a result of reducing the number of separate housing parts
logo
SHENZHEN REFOND OPTOELE...		 A19A-W2SS1612-C8 REFOND-A19A-W2SS1612-C8 Datasheet
1Mb / 23P		 The white light of this light emitting diode is formed by mixing light from a blue light chip
A19A-W2SS2312-C7 REFOND-A19A-W2SS2312-C7 Datasheet
1Mb / 23P		 The white light of this light emitting diode is formed by mixing light from a blue light chip
A19A-W2SS3913-C7 REFOND-A19A-W2SS3913-C7 Datasheet
1Mb / 23P		 The white light of this light emitting diode is formed by mixing light from a blue light chip
A28B-W2SS4712-C7 REFOND-A28B-W2SS4712-C7 Datasheet
1Mb / 23P		 The white light of this light emitting diode is formed by mixing light from a blue light chip
RT-C13A-W2ET0412-P6 REFOND-RT-C13A-W2ET0412-P6 Datasheet
2Mb / 23P		 The white light of this light emitting diode is formed by mixing light from a blue light chip Size
More results




Giới thiệu về Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

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