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LPC55S6X bảng dữ liệu (PDF) - NXP Semiconductors

LPC55S6X Datasheet PDF - NXP Semiconductors
tên linh kiện LPC55S6X
tải về  LPC55S6X tải về
kích thước tập tin   3222.49 Kbytes
Page   135 Pages
nhà sản xuất  NXP [NXP Semiconductors]
Trang chủ  http://www.nxp.com
Logo NXP - NXP Semiconductors
Giải thích chi tiết về linh kiện 32-bit Arm Cortex®-M33; M33 coprocessor

LPC55S6X Datasheet (PDF)

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LPC55S6X Datasheet PDF - NXP Semiconductors

tên linh kiện LPC55S6X
tải về  LPC55S6X Click to download

kích thước tập tin   3222.49 Kbytes
Page   135 Pages
nhà sản xuất  NXP [NXP Semiconductors]
Trang chủ  http://www.nxp.com
Logo NXP - NXP Semiconductors
Giải thích chi tiết về linh kiện 32-bit Arm Cortex®-M33; M33 coprocessor

LPC55S6X bảng dữ liệu (HTML) - NXP Semiconductors


LPC55S6X Thông tin chi tiết sản phẩm

Features and benefits
• ARM Cortex-M33 core (CPU0, r0p3):
– Running at a frequency of up to 150 MHz (device revision 1B only).
– TrustZone®, Floating Point Unit (FPU) and Memory Protection Unit (MPU).
– ARM Cortex M33 built-in Nested Vectored Interrupt Controller (NVIC).
– Non-maskable Interrupt (NMI) input with a selection of sources.
– Serial Wire Debug with eight breakpoints and four watch points. Includes Serial Wire Output for enhanced
debug capabilities.
– System tick timer.
– The configuration of this instance includes MPU, FPU, DSP, ETM, and Trustzone.
• ARM Cortex-M33 co-processor (CPU1, r0p3):
– Running at a CPU frequency of up to 150 MHz (device revision 1B only).
– The configuration of this instance does not include MPU, FPU, DSP, ETM, and Trustzone.
– System tick timer.
• CASPER Crypto co-processor is provided to enable hardware acceleration for various functions required for
certain asymmetric cryptographic algorithms, such as, Elliptic Curve Cryptography (ECC).
• PowerQuad hardware accelerator for (fixed and floating point unit) CMSIS DSP functions with support of SDK
software API faster execution of ARM CMSIS instruction set.
• On-chip memory:
– Up to 640 KB on-chip flash program memory with flash accelerator and 512 byte page erase and write.
– Up to 320 KB total SRAM consisting of 32 KB SRAM on Code Bus, 272 KB SRAM on System Bus (272 KB is contiguous), and additional 16 KB USB SRAM on System Bus which can be used by the USB interface or for general purpose use.
• PRINCE module for real-time encryption of data being written to on-chip flash and decryption of encrypted
flash data during read to allow asset protection, such as securing application code, and enabling secure flash
update.
• On-chip ROM bootloader supports:
– Booting of images from on-chip flash
– Supports CRC32 image integrity checking.
– Supports flash programming through In System Programming (ISP) commands over following interfaces:
USB0/1 interfaces using HID Class device, UART interface (Flexcomm 0) with auto baud, SPI slave
interfaces (Flexcomm 3 or 9) using mode 3 (CPOL = 1 and CPHA = 1), and I2C slave interface (Flexcomm
1)
– ROM API functions: Flash programming API, Power control API, and Secure firmware update API using
NXP Secure Boot file format, version 2.0 (SB2 files).
– Supports booting of images from PRINCE encrypted flash regions.
– Support NXP Debug Authentication Protocol version 1.0 (RSA-2048) and 1.1 (RSA-4096).
– Supports setting a sealed part to Fault Analysis mode through Debug authentication.
• Secure Boot support:
– Uses RSASSA-PKCS1-v1_5 signature of SHA256 digest as cryptographic signature verification.
– Supports RSA-2048 bit public keys (2048 bit modulus, 32-bit exponent).
– Supports RSA-4096 bit public keys (4096 bit modulus, 32-bit exponent).
– Uses x509 certificate format to validate image public keys.
– Supports up to four revocable Root of Trust (RoT) or Certificate Authority keys, Root of Trust establishment
by storing the SHA-256 hash digest of the hashes of four RoT public keys in protected flash region (PFR).
– Supports anti-rollback feature using image key revocation and supports up to 16 Image key certificates
revocations using Serial Number field in x509 certificate.
– Supports Device Identifier Composition Engine (DICE) Specification (version Family 2.0, Level 00 Revision
69) specified by Trusted Computing Group.
• Serial interfaces:
– Flexcomm Interface contains up to nine serial peripherals (Flexcomm Interface 0-7 and Flexcomm Interface
8). Each Flexcomm Interface (except flexcomm 8, which is dedicated for high-speed SPI) can be selected
by software to be a USART, SPI, I2C, and I2S interface. Each Flexcomm Interface includes a FIFO that
supports USART, SPI, and I2S. A variety of clocking options are available to each Flexcomm Interface,
including a shared fractional baud-rate generator, and time-out feature.Flexcomm interfaces 0 to 7 each
provide one channel pair of I2S.
– I2C-bus interfaces support Fast-mode and Fast-mode Plus with data rates of up to 1Mbit/s and with multiple
address recognition and monitor mode. Two sets of true I2C pads also support high-speed Mode (3.4 Mbit/s)
as a slave.
– USB 2.0 full speed host/device controller with on-chip PHY and dedicated DMA controller supporting crystalless
operation in device mode using software library example in technical note (TN00063).
– USB 2.0 high-speed host/device controller with on-chip high-speed PHY.
• Digital peripherals:
– DMA0 controller with 23 channels and up to 22 programmable triggers, able to access all memories and
DMA-capable peripherals.
– DMA1 controller with 10 channels and up to 15 programmable triggers, able to access all memories and
DMA-capable peripherals.
– Secured digital input/output (SD/MMC and SDIO) card interface with DMA support. SDIO with support for up
to two cards. Supported card types are MMC, SDIO, and CE-ATA. Supports SD2.0, and SDR25 (52MHz).
– CRC engine block can calculate a CRC on supplied data using one of three standard polynomials with DMA
support.
– Up to 64 General-Purpose Input/Output (GPIO) pins.
– GPIO registers are located on the AHB for fast access. The DMA supports GPIO ports.
– Up to eight GPIOs can be selected as pin interrupts (PINT), triggered by rising,
falling or both input edges.
– Two GPIO grouped interrupts (GINT) enable an interrupt based on a logical
(AND/OR) combination of input states.
– I/O pin configuration with support for up to 16 function options.
– Programmable Logic Unit (PLU) to create small combinatorial and/or sequential logic networks including
state machines.
• Security Features:
– ARM TrustZone® enabled.
– AES-256 encryption/decryption engine with keys fed directly from PUF or a software supplied key
– Secure Hash Algorithm (SHA2) module supports secure boot with dedicated DMA controller.
– Physical Unclonable Function (PUF) using dedicated SRAM for silicon fingerprint. PUF can generate, store,
and reconstruct key sizes from 64 to 4096 bits. Includes hardware for key extraction.
– True Random Number Generator (TRNG).
– 128 bit unique device serial number for identification (UUID).
– Secure GPIO.
• Timers:
– Five 32-bit standard general purpose asynchronous timers/counters, which support up to four capture inputs
and four compare outputs, PWM mode, and external count input. Specific timer events can be selected to
generate DMA requests.
– One SCTimer/PWM with 8 input and 10 output functions (including 16 capture and match registers). Inputs
and outputs can be routed to or from external pins and internally to or from selected peripherals. Internally,
the SCTimer/PWM supports 16 captures/matches, 16 events, and 32 states.
– 32-bit Real-time clock (RTC) with 1 s resolution running in the always-on power domain. Another timer in the
RTC can be used for wake-up from all low power modes including deep power-down, with 1 ms resolution.
The RTC is clocked by the 32 kHz FRO or 32.768 kHz external crystal.
– Multiple-channel multi-rate 24-bit timer (MRT) for repetitive interrupt generation at up to four programmable,
fixed rates.
– Windowed Watchdog Timer (WWDT) with FRO 1 MHz as clock source.
– The Micro-Tick Timer running from the watchdog oscillator can be used to wake-up the device from sleep
and deep-sleep modes. Includes 4 capture registers with pin inputs.
– 42-bit free running OS Timer as continuous time-base for the system, available in any reduced power
modes. It runs on 32kHz clock source, allowing a count period of more than 4 years.
• Analog peripherals:
– 16-bit ADC with five differential channel pair (or 10 single-ended channels), and with multiple internal and
external trigger inputs and sample rates of up to 1.0 MSamples/sec. The ADC supports simultaneous
conversions, on two ADC input channels belonging to a differential pair.
– Integrated temperature sensor connected to the ADC.
– Comparator with five input pins and external or internal reference voltage.
• Clock generation:
– Internal Free Running Oscillator (FRO). This oscillator provides a selectable 96 MHz output, and a 12 MHz
output (divided down from the selected higher frequency) that can be used as a system clock. The FRO is
trimmed to +/- 2% accuracy over the entire voltage and -40 C to 105 C. For devices with date code 2041
(yyww)and onwards, the FRO is trimmed to +/- 1% accuracy over the entire voltage and 0 C to 85 C.
– 32 kHz Internal Free Running Oscillator FRO. The FRO is trimmed to +/- 2% accuracy over the entire voltage and temperature range.
– Internal low power oscillator (FRO 1 MHz) trimmed to +/- 15% accuracy over the entire voltage and temperature range.
– Crystal oscillator with an operating frequency of 16 MHz to 32 MHz. Option for external clock input (bypass
mode) for clock frequencies of up to 25 MHz.
– Crystal oscillator with 32.768 KHz operating frequency. Option for external clock input (bypass mode) for
clock frequencies of up to 100 kHz.
– PLL0 and PLL1 allows CPU operation up to the maximum CPU rate without the need for a high-frequency
external clock. PLL0 and PLL1 can run from the internal FRO 12 MHz output, the external oscillator, internal
FRO 1 MHz output, or the 32.768 KHz RTC oscillator.
– Clock output function with divider to monitor internal clocks.
– Frequency measurement unit for measuring the frequency of any on-chip or off-chip clock signal.
– Each crystal oscillator has one embedded capacitor bank which can be used as an integrated load
capacitor. Using APIs, the capacitor banks on each crystal pin can tune the frequency for crystals with a
Capacitive Load (CL) which conserves board space and reduces costs.
• Power-saving modes and wake-up:
– Integrated PMU (Power Management Unit) to minimize power consumption.
– Reduced power modes: Sleep, deep-sleep with RAM retention, power-down with RAM retention and CPU0
retention, and deep power-down with RAM retention.
– Configurable wake-up options from peripherals interrupts.
– The Micro-Tick Timer running from the watchdog oscillator, and the Real-Time Clock (RTC) running from the
32.768 kHz clock, can be used to wake-up the device from sleep and deep-sleep modes.
– Power-On Reset (POR, around 0.8 V).
– Brown-Out Detectors (BOD) for VBAT_DCDC for forced reset or interrupt.
• Operating from internal DC-DC converter.
• Single power supply 1.8 V to 3.6 V.
• JTAG boundary scan supported.
• Operating temperature range -40 °C to +105 °C.
• Available in HLQFP100, HTQFP64, VFBGA98, and VFBGA59 packages.




Số phần tương tự - LPC55S6X

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
NXP Semiconductors
LPC55S6X NXP-LPC55S6X Datasheet
4Mb / 128P
32-bit Arm Cortex짰-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS,Flexcomm Interface, SDIO, 32-bit counter/ timers,SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC,Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev.1.9-10 February 2020
LPC55S6X NXP-LPC55S6X Datasheet
3Mb / 133P
32-bit Arm Cortex짰-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers,SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC,
Rev. 2.3-6 August 2021
LPC55S6X NXP-LPC55S6X Datasheet
3Mb / 140P
32-bit Arm Cortex®-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator,...
Rev. 2.4 - 8 December 2022
LPC55S6X NXP-LPC55S6X_V01 Datasheet
3Mb / 133P
32-bit Arm Cortex짰-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers,SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC,
Rev. 2.3-6 August 2021
LPC55S6X NXP-LPC55S6X_V02 Datasheet
3Mb / 140P
32-bit Arm Cortex®-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator,...
Rev. 2.4 - 8 December 2022
More results


Mô tả tương tự - LPC55S6X

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
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NXP Semiconductors
LPC84X NXP-LPC84X Datasheet
2Mb / 97P
32-bit Arm® Cortex®-M0 microcontroller;
Rev. 1.7-27 February 2018
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Analog Devices
ADUCM420 AD-ADUCM420 Datasheet
335Kb / 25P
Precision Analog Microcontroller, 12-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33
1/2021-Revision 0
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NXP Semiconductors
LPC55S6X NXP-LPC55S6X_V01 Datasheet
3Mb / 133P
32-bit Arm Cortex짰-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers,SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC,
Rev. 2.3-6 August 2021
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STMicroelectronics
STM32U575XX STMICROELECTRONICS-STM32U575XX Datasheet
6Mb / 329P
Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU, 240 DMIPS, up to 2 MB Flash memory, 786 KB SRAM
02-Jun-2022
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Nuvoton Technology Corp...
M0A21 NUVOTON-M0A21 Datasheet
8Mb / 212P
Arm® Cortex®-M 32-bit Microcontroller
M480 NUVOTON-M480_V01 Datasheet
10Mb / 473P
Arm® Cortex®-M 32-bit Microcontroller
Rev 2.00
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Infineon Technologies A...
XMC4100 INFINEON-XMC4100_V01 Datasheet
2Mb / 93P
ARM® Cortex®-M4 32-bit processor core
V1.4 2018-09
logo
NXP Semiconductors
LPC55S6X NXP-LPC55S6X_V02 Datasheet
3Mb / 140P
32-bit Arm Cortex®-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator,...
Rev. 2.4 - 8 December 2022
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STMicroelectronics
STM32U5AXXX STMICROELECTRONICS-STM32U5AXXX Datasheet
6Mb / 382P
Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU,240 DMIPS, 4 MB Flash, 2.5 MB SRAM, LTDC, MIPI® DSI, crypto
February 2023 Rev 1
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NXP Semiconductors
LPC55S3X NXP-LPC55S3X Datasheet
3Mb / 164P
32-bit Arm Cortex®-M33, TrustZone, ELS, PRINCE, PKC, 128 KB SRAM
Rev. 3.2 - 22 September 2023
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Giới thiệu về NXP Semiconductors


NXP S bán dẫn là một công ty đa quốc gia được giao dịch công khai, thiết kế, phát triển và sản xuất một loạt các chất bán dẫn và mạch tích hợp cho các ứng dụng khác nhau, bao gồm thị trường ô tô, công nghiệp, truyền thông và tiêu dùng.

Công ty được thành lập vào năm 2006 và có trụ sở tại Eindhoven, Hà Lan.

NXP cung cấp một danh mục sản phẩm rộng lớn, bao gồm vi điều khiển, bộ vi xử lý, IC xác thực an toàn, ICS quản lý năng lượng, RF và các thành phần vi sóng và các giải pháp cảm biến, trong số các thành phần khác.

Các sản phẩm của công ty được thiết kế để tiết kiệm năng lượng, an toàn và đáng tin cậy và được sử dụng trong nhiều ứng dụng khác nhau, bao gồm hệ thống ô tô, tự động hóa và kiểm soát công nghiệp, nhà thông minh và tòa nhà, và các thiết bị được kết nối.

NXP dành riêng cho sự đổi mới và sự hài lòng của khách hàng, và cam kết cung cấp cho khách hàng của mình các giải pháp bán dẫn tốt nhất để đáp ứng nhu cầu của họ.

*Thông tin này chỉ dành cho mục đích thông tin chung, chúng tôi sẽ không chịu trách nhiệm cho bất kỳ tổn thất hoặc thiệt hại nào do thông tin trên gây ra.




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