Description
The SOT-223 package is designed for surface-mounting
using vapor phase, infrared, or wave soldering techniques.
Its unique package design allows for easy automatic pickand-
place as with other SOT or SOP packages but has the
added advantage of improved thermal performance due to
an enlarged tab for heatsinking. Power dissipation of
greater than 1.25 W is possible in a typical surface mount
application.

Features
VDS (V) = -60V
ID = -8A (VGS = -10V)
RDS(ON) < 62mΩ (VGS = -10V)