Description
The SOP-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infra red, or wave soldering techniques.
Power dissipation of greater than 0.8W is possible in a
typical PCB mount application.

Generation V Technology
Ultra Low On-Resistance
Dual N-Channel Mosfet
Surface Mount
Dynamic dv/dt Rating
Fast Switching
Lead-Free

Features
VDS (V) = 55V
ID= 4.7A (VGS=10V)
RDS(ON) < 30mΩ (VGS = 10V)
RDS(ON) < 45mΩ (VGS = 4.5V)