125 ℃ TJ operation(VR<5V)
Unique high power, Half-Pak module
Optimized for OR-ing applications
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
Ultra low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term reliability
Baseplate: Nickel plated; Terminals: Nickel plated
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request