DESCRIPTION
The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the PKFCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.

FEATURES
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• Chip Scale Package 0.050” x 0.030”
• ESD Protection > 25 kilovolts
• Available in Voltages Ranging from 3.3V to 36V
• 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
• Bidirectional Configuration & Monolithic Structure
• Protection for 1 Line
• RoHS Compliant
• REACH Compliant

APPLICATIONS
• Cellular Phones
• MCM Boards
• Wireless Communication Circuits
• IR LEDs
• SMART & PCMCIA Cards