This is the original high reliability molded
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes,
eight of which (A through H) are fully qualified
to MILPRF-55365/4, and also includes the
original sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including
convection reflow solder, conductive epoxy or
compression bonding techniques.
The parts also carry full polarity and capacitance
/ voltage marking. The five smaller cases are
characterized by their low profile construction,
with the A case being the world’s smallest
molded military tantalum chip.
All 4V to 50V ratings are qualified to MILPRF-55365 Weibull “B”, “C”, “D” and “T” levels,
with all surge options (“A”, “B” & “C”) available.
For Space Level applications, KYOCERA AVX SRC
9000 qualification is recommended (see ratings
table for part number availability).
There are four termination finishes available: solder
plated, fused solder plated, hot solder dipped and
gold plated (these are “H”, “K”, “C” and “B” termination,
respectively, per MIL-PRF-55365). In addition, the
molding compound has been selected to meet the
requirements of UL94V-0 (Flame Retardancy) and
outgassing requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in the
back of the High Reliability Tantalum Catalog