Features
Package
 Fully isolated Dual In-Line molded module
 Very low thermal resistance due to DCB substrate
 Lead-free terminal plating; RoHS compliant
Inverter
 TRENCHSTOP™ IGBTs for Inverter
 Rugged SOI gate driver technology with stability
against transient and negative voltage
 Allowable negative VS potential up to -11 V
for signal transmission at VBS = 15 V
 Integrated bootstrap functionality
 Over current shutdown
 Built-in NTC thermistor for temperature monitor
 Under-voltage lockout at all channels
 Low-side common emitter
 Sleep function
 Fast track shutdown
 Cross-conduction prevention
 All of 6 switches turn off during protection
PFC
 CoolMOS™ Power MOSFET for PFC
 Rapid switching emitter controlled diode