Features and benefits
• 300 mW total power dissipation
• Very small 1.6 mm x 1.2 mm x 0.55 mm ultra thin package
• Excellent coplanarity due to straight leads
• Low collector capacitance
• Improved thermal behaviour due to flat leads
• Reduces number of components as replacement of two SC-75/SC-89 packaged BISS
transistors
• Reduces required board space
• Reduces pick and place costs