Features
Glasspassivatedchipjunction
Ideallysuitedforautomaticassembly
HighSurgeCurrentCapability
DesignedforSurfaceMountApplication
LeadfreeincompliancewithEURoHS2.0
GreenmoldingcompoundasperIEC61249standard

MechanicalData
Case:ABSPackage
Terminals:SolderableperMIL-STD-750,Method2026
Approx.Weight:0.0031ounces,0.088grams

Application
QuickCharger(<20W)
Generalpoweradapter(<30W)
In-doorLedlighting,Bulb/PARlighting
Netcompower(<35W)
Smartspeakeradapter(<20W)