Electrical Features
•Blocking voltage 750V
•Low VCEsat
•Low Switching Losses
•Low Qg and Crss
•Low Inductive Design
•Tvj op = 150°C
•Short-time extended Operation Temperature
Tvj op = 175°C

Mechanical Features
•4.2kV DC 1sec Insulation
•High Creepage and Clearance Distances
•Compact design
•High Power Density
•Copper Base Plate
•Guiding elements for PCB and cooler assembly
•Integrated NTC temperature sensor
•PressFIT Contact Technology
•RoHS compliant
•UL 94 V0 module frame

Description
The HybridPACKTM Drive is a very compact
six-pack module optimized for hybrid and electric
vehicles. The product FS660R08A6P2FLB comes
with a flat baseplate and is a 750V/660A module
derivate within the HybridPACK Drive family. The
power module implements the new EDT2 IGBT
generation, which is an automotive Micro-Pattern
Trench-Field-Stop cell design optimized for electric
drive train applications. The chipset has benchmark
current density combined with short circuit
ruggedness and increased blocking voltage for
reliable inverter operation under harsh
environmental conditions. The EDT2 IGBTs also
show excellent light load power losses, which helps
to improve system efficiency over a real driving
cycle. The EDT2 IGBT was optimized for
applications with switching frequencies in the range
of 10 kHz.
The new The HybridPACKTM Drive power module
family comes with mechanical guiding elements
supporting easy assembly processes for customers.
Furthermore, the press-fit pins for the signal
terminals avoid additional time consuming selective
solder processes, which provides cost savings on
system level and increases system reliability. The
two products in the The HybridPACKTM Drive family
with flat baseplate in the FS660R08A6P2FLB and
PinFin baseplate in the FS820R08A6P2LB allow a
very cost effective scaling for different inverter
power levels at a minimum inverter design effort.