FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Built-in strain rellef
- Super fast recovery time for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition

MECHANICAL DATA
   Case: DO-214AC (SMA)
   Molding compound, UL flammability classification rating 94V-0
   Base P/N with suffix "G" on packing code - Green compound (halogen-free)
   Base P/N with prefix "H" on packing code - AEC-Q101 qualified
   Terminal: Matte tin plated leads, solderable per JESD22-B102
   Meet JESD 201 class 1A whisker test
   with prefix "H" on packing code meet JESD 201 class 2 whisker test
   Polarity: Indicated by cathode band
   Weight: 0.06 g (approximately)