1 Features
Processor Cores:
• Up to Quad 64-bit Arm® Cortex®-A53
microprocessor subsystem at up to 1.4 GHz
– Quad-core Cortex-A53 cluster with 512KB L2
shared cache with SECDED ECC
– Each A53 Core has 32KB L1 DCache with
SECDED ECC and 32KB L1 ICache with Parity
protection
• Single-core Arm® Cortex®-M4F MCU at up to 400
MHz
– 256KB SRAM with SECDED ECC
• Dedicated Device and Power Manager
Multimedia:
• Display subsystem
– Dual display support
– 1920x1080 @ 60fps for each display
– 1x 2048x1080 + 1x 1280x720
– Up to 200-MHz pixel clock support with
Independent PLL for each display
– OLDI/LVDS (4 lanes - 2x) and 24-bit RGB
parallel interface
– Support safety feature such as freeze frame
detection and MISR data check
• 3D Graphics Processing Unit
– 1 pixel per clock or higher
– Fillrate greater than 500 Mpixels/sec
– >500 MTexels/s, >8 GFLOPs
– Supports at least 2 composition layers
– Supports up to 2048x1080 @60fps
– Supports ARGB32, RGB565 and YUV formats
– 2D graphics capable
– OpenGL 3.x/2.0/1.1 + Extensions, Vulkan 1.2
• One Camera Serial interface (CSI-Rx) - 4 Lane
with DPHY
– MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
– Support for 1,2,3 or 4 data lane mode up to
2.5Gbps
– ECC verification/correction with CRC check +
ECC on RAM
– Virtual Channel support (up to 16)
– Ability to write stream data directly to DDR via
DMA
Memory Subsystem:
• Up to 816KB of On-chip RAM
– 64KB of On-chip RAM (OCSRAM) with
SECDED ECC , Can be divided into smaller
banks in increments of 32KB for as many as 2
separate memory banks
– 256KB of On-chip RAM with SECDED ECC in
SMS Subsystem
– 176KB of On-chip RAM with SECDED ECC in
SMS Subsystem for TI security firmware
– 256KB of On-chip RAM with SECDED ECC in
Cortex-M4F MCU subsystem
– 64KB of On-chip RAM with SECDED ECC in
Device and Power Manager Subsystem
• DDR Subsystem (DDRSS)
– Supports LPDDR4, DDR4 memory types
– 16-Bit data bus with inline ECC
– Supports speeds up to 1600 MT/s
– Max addressable range
• 8GBytes with DDR4
• 4GBytes with LPDDR4
Functional Safety:
• Functional Safety-Compliant targeted [Industrial]
– Developed for functional safety applications
– Documentation will be available to aid IEC
61508 functional safety system design
– Systematic capability up to SIL 3 targeted
– Hardware Integrity up to SIL 2 targeted
– Safety-related certification
• IEC 61508 by TUV SUD planned
• Functional Safety-Compliant targeted [Automotive]
– Developed for functional safety applications
– Documentation will be available to aid ISO
26262 functional safety system design
– Systematic capability up to ASIL D targeted
– Hardware integrity up to ASIL B targeted
– Safety-related certification
• ISO 26262 by TUV SUD planned
• AEC-Q100 qualified
Security:
• Hardware Security Module
– Dedicated dual-core Arm Cortex-M4F Security
co-processor with 426KB RAM for key and
security management, with dedicated device
level interconnect for security
– Dedicated security DMA and IPC subsystem for
isolated processing
• Secure boot supported
– Hardware-enforced Root-of-Trust (RoT)
– Support to switch RoT via backup key
– Support for takeover protection, IP protection,
and anti-roll back protection
• Cryptographic acceleration supported
– Session-aware cryptographic engine with ability
to auto-switch key-material based on incoming
data stream
– Supports cryptographic cores
• AES – 128/192/256 Bits key sizes
• SHA2 – 224/256/384/512
• DRBG with true random number generator
• PKA (Public Key Accelerator) to Assist in
RSA/ECC processing
– DMA support
• Debugging security
– Secure software controlled debug access
– Security aware debugging
• Trusted Execution Environment (TEE) supported
– Arm TrustZone® based TEE
– Extensive firewall support for isolation
– Secure watchdog/timer/IPC
• Secure storage support
• On-the-Fly encryption support for OSPI interface in
XIP mode
PRU Subsystem:
• Dual-core Programmable Real-Time Unit running
up to 333 MHz and Industrial Communication
Subystem (PRU-ICSS)
• Intended for driving GPIO for cycle accurate
protocols such as additional:
– General Purpose Input/Output (GPIO)
– UARTs
– I2C
– External ADC
• 16KByte program memory per PRU with SECDED
ECC
• 8KB data memory per PRU with SECDED ECC
• 32KB general purpose memory with SECDED
ECC
• CRC32/16 HW accelerator
• Scratch PAD memory with 3 banks of 30 x 32-bit
registers
• 1 Industrial 64-bit timer with 9 capture and
16 compare events, along with slow and fast
compensation
• 1 interrupt controller (INTC), minimum of 64 input
events supported
High-Speed Interfaces:
• Integrated Ethernet switch supporting (total 2
external ports)
– RMII(10/100) or RGMII (10/100/1000)
– IEEE1588 (Annex D, Annex E, Annex F with
802.1AS PTP)
– Clause 45 MDIO PHY management
– Packet Classifier based on ALE engine with
512 classifiers
– Priority based flow control
– Time sensitive networking (TSN) support
– Four CPU H/W interrupt Pacing
– IP/UDP/TCP checksum offload in hardware
• Two USB2.0 Ports
– Port configurable as USB host, USB peripheral,
or USB Dual-Role Device (DRD mode)
– Integrated USB VBUS detection
– Trace over USB supported
General Connectivity:
• 9x Universal Asynchronous Receiver-Transmitters
(UART)
• 5x Serial Peripheral Interface (SPI) controllers
• 6x Inter-Integrated Circuit (I2C) ports
• 3x Multichannel Audio Serial Ports (McASP)
– Transmit and Receive Clocks up to 50 MHz
– Up to 16/10/6 Serial Data Pins across 3x
McASP with Independent TX and RX Clocks
– Supports Time Division Multiplexing (TDM),
Inter-IC Sound (I2S), and Similar Formats
– Supports Digital Audio Interface Transmission
(SPDIF, IEC60958-1, and AES-3 Formats)
– FIFO Buffers for Transmit and Receive (256
Bytes)
– Support for audio reference output clock
• 3x enhanced PWM modules (ePWM)
• 3x enhanced Quadrature Encoder Pulse modules
(eQEP)
• 3x enhanced Capture modules (eCAP)
• General-Purpose I/O (GPIO), All LVCMOS I/O can
be configured as GPIO
• 3x Controller Area Network (CAN) modules with
CAN-FD support
– Conforms w/ CAN Protocol 2.0 A, B and ISO
11898-1
– Full CAN FD support (up to 64 data bytes)
– Parity/ECC check for Message RAM
– Speed up to 8Mbps
Media and Data Storage:
• 3x Secure Digital® (SD®) (4b+4b+8b) interface
– 1x 8-bit eMMC interface up to HS200 speed
– 2x 4-bit SD/SDIO interface up to UHS-I
– Compliant with eMMC 5.1, SD 3.0 and SDIO
Version 3.0
• 1× General-Purpose Memory Controller (GPMC)
up to 133 MHz
– Flexible 8- and 16-Bit Asynchronous Memory
Interface With up to four Chip (22-bit address)
Selects (NAND, NOR, Muxed-NOR, and
SRAM)
– Uses BCH Code to Support 4-, 8-, or 16-Bit
ECC
– Uses Hamming Code to Support 1-Bit ECC
– Error Locator Module (ELM)
• Used With the GPMC to Locate Addresses
of Data Errors From Syndrome Polynomials
Generated Using a BCH Algorithm
• Supports 4-, 8-, and 16-Bit Per 512-Byte
Block Error Location Based on BCH
Algorithms
• OSPI/QSPI with 166-MHz DDR / 200-MHz SDR
– Support for Serial NAND and Serial NOR flash
devices
– Up to 4 CS supported
– 4GBytes memory address support
– XIP mode with optional on-the-fly encryption
Power Management:
• Low power modes supported by Device Manager
– Partial IO support for CAN/GPIO/UART wakeup
– DeepSleep
– MCU Only
– Standby
– Dynamic frequency scaling for Cortex-A53
Optimal Power Management Solution:
• Recommended TPS65219 Power Management
ICs (PMIC)
– Companion PMIC specially designed to meet
device power supply requirements
– Flexible mapping and factory programmed
configurations to support different use cases
Boot Options:
• UART
• I2C EEPROM
• OSPI/QSPI Flash
• GPMC NOR/NAND Flash
• Serial NAND Flash
• SD Card
• eMMC
• USB (host) boot from Mass Storage device
• USB (device) boot from external host (DFU mode)
• Ethernet
Technology / Package:
• 16-nm technology
• 13 mm x 13 mm, 0.5-mm pitch, 425-pin FCCSP
BGA (ALW)
• 17.2 mm x 17.2 mm, 0.8-mm pitch, 441-pin
FCBGA (AMC)

2 Applications
• Human Machine Interfaces (HMI)
• Retail automation
• Driver Monitoring System (DMS/OMS) / In-Cabin Monitoring (ICM)
• Telematics Control Unit (TCU)
• 3D Point Cloud
• Vehicle to Infrastructure / Vehicle to Vehicle (V2X / V2V)
• 3D Re-configurable automotive instrument cluster
• Appliance user interface and connectivity
• Medical equipment

3 Description
The low-cost AM62x Sitara™ MPU family of application processors are built for Linux® application development.
With scalable Arm® Cortex®-A53 performance and embedded features, such as: dual-display support and 3D
graphics acceleration, along with an extensive set of peripherals that make the AM62x device well-suited for
a broad range of industrial and automotive applications while offering intelligent features and optimized power
architecture as well.
Some of these applications include:
• Industrial HMI
• EV charging stations
• Touchless building access
• Driver monitoring systems
AM62x Sitara™ processors are industrial-grade in the 13 x 13 mm package (ALW) and can meet the AECQ100
automotive standard in the 17.2 x 17.2 mm package (AMC). Industrial and Automotive functional safety
requirements can be addressed using the integrated Cortex-M4F cores and dedicated peripherals, which can all
be isolated from the rest of the AM62x processor.
The 2-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking
(TSN) support. An additional PRU module on the device enables real-time I/O capability for customer’s own
use cases. In addition, the extensive set of peripherals included in AM62x enables system-level connectivity,
such as: USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external
ASIC/FPGA. The AM62x device also supports secure boot for IP protection with the built-in Hardware Security
Module (HSM) and employs advanced power management support for portable and power-sensitive applications
Products in the AM62x processor family:
• AM623—IoT and gateway SoC with Arm® Cortex®-A53 based object and gesture recognition
• AM625—Human-Machine InteractionSoC with Arm® Cortex®-A53 based edge AI, full-HD dual-display