BCM5702 OVERVIEW
The BCM5702 is a fully-integrated 10/100/1000BASE-T Gigabit Ethernet media access control and physical layer transceiver solution for high-performance network applications. The BCM5702 is a highly integrated solution combining a triple-speed, IEEE 802.3 compliant media access controller (MAC), PCI bus interfaces, an on-chip buffer memory, and an integrated physical layer transceiver in a single device. The BCM5702 is fabricated in a low-voltage 0.13-µm CMOS process, providing a low-power system solution. By itself the BCM5702 provides a complete, single-chip, Gigabit Ethernet NIC or LOM solution.

FEATURES
• Single-chip solution for LAN on Motherboard (LOM) and network interface card (NIC) applications
    • Integrated 10BASE-T/100BASE-TX/1000BASE-T transceivers
    • 10/100/1000 Mbps triple-speed media access controller (MAC)
    • Host interfaces - PCI v2.2, 32/64-bit, 33 MHz
    • Ultra-deep, 96 KB, on-chip packet buffer
    • Dual, high-speed RISC cores with 16 KB caches
    • SMBus controller
    • On-chip power circuit controller and Wake on LAN power switching circuit
• Performance features
    • TCP, IP, UDP checksum
    • TCP segmentation
    • CPU task offload
    • Adaptive interrupts
    • Ultra-deep, 96-KB packet buffer
• Robust manageability
    • PXE 2.0 remote boot
    • Alert Standard Format (ASF 1.0 support)
    • Wake on LAN
    • Out-of-box Wake on LAN
    • Statistics gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB)
    • Comprehensive diagnostic and configuration software suite
    • ACPI 1.1a compliant (multiple power modes)
• Advanced network features
    • Priority queuing (802.1p layer 2 priority encoding; support for four priority queues)
    • Virtual LANs (802.1q VLAN tagging; support for up to 64 VLANs)
    • Jumbo frames (9 KB)
    • 802.3x flow control
• Advanced server features
    • Link aggregation (802.3ad, GEC/FEC, Smart Load Balancing™ (supports heterogeneous teams))
    • Heterogeneous, mixed-speed failover
    • Hot-Plug PCI support
• Low power, 0.13-µm CMOS design
• 196-pin BGA package
• 3.3V I/Os (5V tolerant)
• JTAG