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  • VLS252010HBX-R33M-1

  • AI
    The **VLS252010HBX-R33M-1** is a high-performance, surface-mount (SMD) power inductor manufactured by **TDK**. It is part of the VLS-HBX series, designed specifically for power circuits in compact electronic devices like smartphones and tablets. --- ### 1. Technical Specifications Below are the primary electrical and physical characteristics of the component: | Feature | Specification | | :--- | :--- | | **Inductance** | 0.33 µH | | **Tolerance** | ±20% (M) | | **DC Resistance (Max)** | 0.026 Ω (26 mΩ) | | **Rated Current (Isat)** | 5.35 A (Saturation Current) | | **Rated Current (Itemp)** | 3.96 A (Temperature Rise Current) | | **Operating Temperature** | -40°C to +105°C | | **Package Size (Metric)** | 2520 (2.5mm x 2.0mm) | | **Height** | 1.0 mm (Max) | --- ### 2. Part Number Breakdown Understanding the nomenclature helps in identifying the specific attributes: * **VLS**: Series Name (Wound Ferrite) * **252010**: Dimensions (2.5mm length x 2.0mm width x 1.0mm height) * **HBX**: Magnetic shield type with high-current metallic magnetic material * **R33**: Inductance value (R33 = 0.33 µH) * **M**: Inductance tolerance (±20%) * **1**: Internal TDK code/Packaging style --- ### 3. Key Features & Advantages * **Metallic Magnetic Material**: Unlike standard ferrite inductors, the HBX series uses a metallic powder core. This allows for a higher saturation current ($I_{sat}$) and better performance in high-load conditions. * **Magnetic Shielding**: The structure is magnetically shielded, which minimizes Electromagnetic Interference (EMI) with surrounding components on a dense PCB. * **Low Profile**: With a height of only 1.0mm, it is ideal for slim portable electronics. * **High Efficiency**: Low DC resistance (DCR) minimizes power loss as heat, extending battery life in mobile devices. --- ### 4. Common Applications This inductor is typically used in **DC-DC Converter circuits** for: 1. **Smartphones & Wearables**: Managing power for CPUs and GPUs. 2. **HDD/SSD**: Power regulation for high-speed data storage. 3. **Communication Modules**: Low-noise power supply for Bluetooth or Wi-Fi chips. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between Isat and Itemp in this inductor?
    • ⤷ How does metallic magnetic material compare to standard ferrite cores?
    • ⤷ Can this inductor be used in automotive applications?