The **VLS201612HBX-R68M-1** is a high-performance, surface-mount (SMD) power inductor manufactured by **TDK**. It belongs to the VLS-HBX series, which features a magnetic shield and is designed for high-density power supply circuits. ### 1. Key Technical Specifications The following table summarizes the primary electrical and physical characteristics of the component: | Feature | Specification | | :--- | :--- | | **Inductance** | 0.68 µH | | **Tolerance** | ±20% (M) | | **DC Resistance (Max)** | 0.054 Ω (54 mΩ) | | **Rated Current (Isat)** | 4.35 A (Based on inductance change) | | **Rated Current (Itemp)** | 3.12 A (Based on temperature rise) | | **Operating Temperature** | -40°C to +105°C | | **Dimensions (LxWxH)** | 2.0mm x 1.6mm x 1.2mm | | **Magnetic Shielding** | Yes (Resin based) | --- ### 2. Part Number Breakdown Understanding the nomenclature helps in identifying variants: - **VLS**: Product Series (Wound core, magnetic shield) - **201612**: Case size (2.0mm length x 1.6mm width x 1.2mm height) - **HBX**: High current application / Metallic magnetic material - **R68**: Inductance value (R68 = 0.68 µH) - **M**: Inductance tolerance (±20%) - **1**: Internal TDK code/Packaging suffix --- ### 3. Core Features and Technology * **Metallic Magnetic Material:** Unlike standard ferrite inductors, the HBX series uses a metallic magnetic material. This allows for higher saturation currents in a smaller footprint. * **Magnetic Shielding:** The coil is encapsulated in a magnetic resin. This reduces electromagnetic interference (EMI) and prevents the magnetic flux from affecting neighboring components on a PCB. * **Low Profile:** At only 1.2mm in height, it is ideal for slim portable electronics. ### 4. Typical Applications This inductor is commonly found in DC-to-DC converter circuits for: * **Smartphones and Tablets:** Power management modules. * **Wearable Devices:** Smartwatches or fitness trackers requiring high efficiency. * **HDD/SSD:** Power rails for portable storage devices. * **IoT Modules:** Compact wireless communication sensors. ---