The **TSOP932..P10TR** series consists of miniaturized IR receiver modules designed for infrared remote control systems. These components integrate a photo detector and a preamplifier into a single package, featuring an internal filter for Pulse Code Modulation (PCM) frequency. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Component Type** | Infrared Receiver Module | | **Supply Voltage ($V_S$)** | 2.0 V to 3.6 V | | **Supply Current ($I_S$)** | 0.35 mA (typical) | | **Transmission Distance** | Up to 40 meters | | **Carrier Frequency** | 30 kHz to 56 kHz (depending on specific variant) | | **Directivity** | $\pm$ 45 degrees | | **Package Style** | Mold (P10) - Surface Mount (SMD) | --- ### 2. Internal Block Diagram Functional Parts The TSOP932 series contains several critical electronic sub-circuits within the epoxy package: 1. **Photo Diode:** Converts incoming IR light into an electrical signal. 2. **Preamplifier:** Boosts the weak signal from the photodiode. 3. **Automatic Gain Control (AGC):** Adjusts sensitivity to suppress noise from ambient light (like sunlight or fluorescent bulbs). 4. **Band Pass Filter:** Only allows the specific carrier frequency (e.g., 38kHz) to pass through, filtering out other IR noise. 5. **Demodulator:** Removes the carrier frequency to leave only the original data pulse. --- ### 3. Application Circuit To integrate this part into a microcontroller circuit, a simple RC filter is recommended to stabilize the power supply. ```cpp // Typical Pin Configuration // Pin 1: OUT (Data Output) // Pin 2: GND (Ground) // Pin 3: Vs (Power Supply) // Basic Connection Logic: // [VCC] --- [Resistor 100 Ohm] ---+--- [Pin 3: Vs] // | // [Capacitor 4.7uF] // | // [GND] --------------------------+--- [Pin 2: GND] ``` --- ### 4. Distinguishing the Suffixes * **TSOP932..**: Indicates the basic series and AGC type (AGC2). * **P10**: Refers to the physical package type (a specific SMD "Mold" side-view or top-view package). * **TR**: Stands for **Tape and Reel**, indicating the component is packaged for automated pick-and-place assembly. ---