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  • TPQH201610TF-4R7M-R

  • AI
    The **TPQH201610TF-4R7M-R** is a high-performance, surface-mount (SMD) power inductor. This component is specifically designed for power management circuits in compact electronic devices where space is limited but high efficiency is required. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical characteristics of the component: | Segment | Meaning | Description | | :--- | :--- | :--- | | **TPQH** | Series Code | High-current, shielded power inductor series. | | **201610** | Dimensions | Metric size: 2.0mm x 1.6mm x 1.0mm. | | **TF** | Material/Type | Often refers to Thin-Film or specific ferrite core technology. | | **4R7** | Inductance Value | **4.7 µH** (R denotes the decimal point). | | **M** | Tolerance | **±20%** (Standard for power inductors). | | **R** | Packaging | Tape & Reel for automated assembly. | --- ### 2. Key Technical Specifications While exact values can vary slightly by manufacturer (common manufacturers for this type include Taiyo Yuden or Cyntec equivalents), typical specs for this part include: * **Inductance:** 4.7 µH * **DC Resistance (DCR):** Typically ranges from 200mΩ to 300mΩ (Low DCR minimizes power loss). * **Saturation Current ($I_{sat}$):** The current at which inductance drops by ~30%. Usually around 1.1A - 1.5A. * **Rated Current ($I_{rms}$):** The current that causes a 40°C temperature rise. Usually around 1.0A - 1.3A. * **Operating Temperature:** -40°C to +125°C. --- ### 3. Construction and Features * **Magnetic Shielding:** The part is magnetically shielded to reduce Electromagnetic Interference (EMI), which is critical for densely packed PCBs. * **Metal Alloy/Ferrite Core:** Utilizes advanced core materials to handle high transient current spikes without core saturation. * **Low Profile:** The "10" in the part number indicates a max height of 1.0mm, making it ideal for smartphones, wearables, and tablets. --- ### 4. Common Applications This inductor is typically found in the **DC-DC Converter** stages of mobile electronics: 1. **Buck Converters:** Stepping down battery voltage for CPU/GPU cores. 2. **LED Drivers:** Powering backlights for small displays. 3. **IoT Devices:** Providing stable power in battery-operated sensors. 4. **PMICs:** Integrated into Power Management Integrated Circuits for localized voltage regulation.
    ✨ Follow-up Questions
    • ⤷ What are the direct equivalents for this part from manufacturers like TDK or Murata?
    • ⤷ How does the saturation current affect the efficiency of a buck converter?
    • ⤷ What are the soldering profile recommendations for this specific SMD package size?