TPI13067F-R22M
AI

## TPI13067F-R22M Electronic Part Overview
The **TPI13067F-R22M** is a high-current, surface-mount (SMD) power inductor, typically manufactured by **ITG Electronics**. It is designed for high-frequency power conversion applications, particularly where space is limited and efficiency is critical.
### 1. Technical Specifications
The alphanumeric code provides specific details regarding its electrical characteristics and physical dimensions:
| Parameter | Specification |
| :--- | :--- |
| **Inductance** | 0.22 µH (220 nH) |
| **Tolerance** | ±20% (indicated by 'M') |
| **Type** | Flat Wire, High Current Inductor |
| **DC Resistance (DCR)** | Extremely Low (typically < 0.3 mΩ) |
| **Saturation Current ($I_{sat}$)** | Very High (often exceeding 60A - 100A) |
| **Operating Temperature** | -40°C to +125°C |
---
### 2. Physical Characteristics
The "13067" in the part number usually refers to the physical footprint of the component:
* **Dimensions:** Approximately **13.5mm x 6.5mm** (length x width).
* **Height:** The "7" often indicates a height of approximately **7.0mm**.
* **Construction:** It uses a **Flat Wire** winding technique. Compared to round wire, flat wire reduces the skin effect at high frequencies and allows for a higher fill factor, which lowers DC resistance (DCR) and improves thermal management.
---
### 3. Key Features & Benefits
* **Low Core Loss:** Uses advanced alloy powder cores to minimize energy loss during high-frequency switching.
* **High Saturation:** Designed to handle large current spikes without the inductance dropping significantly (soft saturation).
* **Shielded Design:** The molded construction provides magnetic shielding, reducing Electromagnetic Interference (EMI) with neighboring components.
* **RoHS Compliant:** Meets environmental standards for lead-free electronics.
---
### 4. Common Applications
This inductor is primarily found in high-performance power stages, including:
1. **Voltage Regulator Modules (VRMs):** Used in CPU and GPU power delivery on motherboards and server cards.
2. **DC-DC Converters:** High-efficiency buck, boost, or buck-boost converters.
3. **Distributed Power Systems:** Used in telecommunications and networking hardware.
4. **Industrial Computing:** Power supplies for high-load automation controllers.
---
### 5. Identification Breakdown
```text
TPI 13067 F - R22 M
| | | | |
| | | | +-- Tolerance (M = ±20%)
| | | +----- Inductance Value (R22 = 0.22µH)
| | +--------- Series/Material Code (Flat Wire)
| +--------------- Dimensions (13.5 x 6.5 x 7.0 mm)
+-------------------- Manufacturer/Product Category (Power Inductor)
```
- ⤷
What is the maximum saturation current rating for the TPI13067F-R22M?
- ⤷ How does flat wire construction compare to round wire in power inductors?
- ⤷ Are there recommended PCB footprint patterns for the 13067 package size?